Datasheet > PM50B6LA060_09

PM50B6LA060_09

更新时间： 2024-11-17 12:50:55

品牌	Logo	应用领域
三菱 - MITSUBISHI		/
页数	文件大小	规格书
10页	300K
描述
FLAT-BASE TYPE INSULATED PACKAGE

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PM50B6LA060_09 数据手册

MITSUBISHI <INTELLIGENT POWER MODULES>

PM50B6LA060

FLAT-BASE TYPE

INSULATED PACKAGE

PM50B6LA060

FEATURE

a) Adopting new 5th generation IGBT (CSTBT^TM) chip, which

performance is improved by 1µm fine rule process.

For example, typical Vce(sat)=1.55V @Tj=125°C

b) Over-temperature protection by detecting Tj of the CSTBT^TM

chips and error output is possible from all each conserva-

tion upper and lower arm of IPM.

c) New small package

Reduce the package size by 10%, thickness by 22% from

S-DASH series.

• 2φ 50A, 600V Current-sense IGBT type inverter

• 50A, 600V Current-sense Chopper IGBT

• Monolithic gate drive & protection logic

• Detection, protection & status indication circuits for, short-

circuit, over-temperature & under-voltage (P-Fo available

from upper arm devices)

• UL Recognized Yellow Card No.E80276(N)

File No.E80271

APPLICATION

Photo voltaic power conditioner

PACKAGE OUTLINES

Dimensions in mm

B E L

120

106

3.25

19.75

15.25

6-2

2-φ5.5

MOUNTING HOLES

(19.75)

3-2

6-M5 NUTS

22 ⁺_–

10.75

0.5

32.75

Terminal code

19-■0.5

1. VUPC

2. UFO

8. VVP1

9. NC

15. Br

16. UN

17. VN

18. WN

19. Fo

3. UP

10. NC

11. NC

12. NC

13. VNC

14. VN1

4. VUP1

5. VVPC

6. VFO

7. VP

Jun. 2007

12 3 4 5 6 7...10

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