品牌 | Logo | 应用领域 |
三菱 - MITSUBISHI | / | |
页数 | 文件大小 | 规格书 |
8页 | 125K | |
描述 | ||
INTELLIGENT POWER MODULES FLAT-BASE TYPE INSULATED PACKAGE |
是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Not Recommended | 包装说明: | , MODULE,25LEAD,5.3 |
Reach Compliance Code: | unknown | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.34 |
模拟集成电路 - 其他类型: | AC MOTOR CONTROLLER | JESD-30 代码: | R-XUFM-X25 |
功能数量: | 1 | 端子数量: | 25 |
最大输出电流: | 300 A | 封装主体材料: | UNSPECIFIED |
封装等效代码: | MODULE,25LEAD,5.3 | 封装形状: | RECTANGULAR |
封装形式: | FLANGE MOUNT | 峰值回流温度(摄氏度): | 260 |
电源: | 15,600 V | 认证状态: | Not Qualified |
子类别: | Motion Control Electronics | 最大供电电压 (Vsup): | 16.5 V |
最小供电电压 (Vsup): | 13.5 V | 标称供电电压 (Vsup): | 15 V |
表面贴装: | NO | 技术: | HYBRID |
端子形式: | UNSPECIFIED | 端子位置: | UPPER |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | Base Number Matches: | 1 |
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