Datasheet > PM150CLA060_05

PM150CLA060_05

更新时间： 2024-01-15 10:59:14

品牌	Logo	应用领域
三菱 - MITSUBISHI		/
页数	文件大小	规格书
8页	119K
描述
INTELLIGENT POWER MODULES FLAT-BASE TYPE INSULATED PACKAGE

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PM150CLA060_05 数据手册

MITSUBISHI <INTELLIGENT POWER MODULES>

PM150CLA060

FLAT-BASE TYPE

INSULATED PACKAGE

PM150CLA060

FEATURE

a) Adopting new 5th generation IGBT (CSTBT) chip, which

performance is improved by 1µm fine rule process.

For example, typical Vce(sat)=1.5V @Tj=125°C

b) I adopt the over-temperature conservation by Tj detection of

CSTBT chip, and error output is possible from all each con-

servation upper and lower arm of IPM.

c) New small package

Reduce the package size by 10%, thickness by 22% from

S-DASH series.

• 3φ 150A, 600V Current-sense IGBT type inverter

• Monolithic gate drive & protection logic

• Detection, protection & status indication circuits for, short-

circuit, over-temperature & under-voltage (P-Fo available

from upper arm devices)

• Acoustic noise-less 15kW/18.5kW class inverter application

• UL Recognized

Yellow Card No.E80276(N)

File No.E80271

APPLICATION

General purpose inverter, servo drives and other motor controls

PACKAGE OUTLINES

Dimensions in mm

120

106

3.25

19.75

15.25

6-2

2-φ5.5

19.75

3-2

MOUNTING HOLES

6-M5 NUTS

22 ⁺_–

10.75

0.5

32.75

Terminal code

1. VUPC 11. WP

19-■0.5

2. UFO

3. UP

12. VWP1

13. VNC

4. VUP1 14. VN1

5. VVPC 15. NC

6. VFO

7. VP

16. UN

17. VN

8. VVP1 18. WN

9. VWPC 19. Fo

10. WFO

May 2005

12 3 4 5 6 7 8

中文翻译

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