Datasheet > PLCC

PLCC

更新时间： 2022-12-29 04:22:37

品牌	Logo	应用领域
AMKOR		/
页数	文件大小	规格书
2页	387K
描述
Amkor’s PLCC IC package portfolio provides

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PLCC 数据手册

LEADFRAME

data sheet

PLCC

Features:

Amkor’s PLCC IC package portfolio provides:

• .352” x .352” to 1.152” x 1.152” body size

• 20 to 84 lead counts

• JEDEC standard compliant

• Available with heatspreader option

• Fine pitch wire bond capability

Multi-Layer PCB

Thermal Resistance:

Plastic Leaded Chip

Carrier (PLCC)

Packages:

Theta JA (°C/W) by Velocity

Body Size

(mm)

Pad Size

(mm)

7.8 x 7.8

Pkg

30.0

24.4

200

24.5

19.0

500

22.0

16.6

44 ld

44 ld*

16.6 x 16.6

Amkor’s PLCC offerings cover the total

range offered by the industry. It includes all

square body packages from 20 lead through

84 lead. Also included is the rectangular

body format of the 32 lead. All PLCC

products are offered with and without

heatspreaders. The heatspreader versions

are identical in form factor to the standard

non-heatspreader versions. Both versions

are JEDEC compliant in all respects. The

heatspreader versions give the system

designer greater latitude in thermally

enhanced board level and/or system design.

All products utilize the most advanced

manufacturing equipment offered today.

Lead free and green material set are

qualified.

*With Drop-in heatspreader option

Tested @ 1W

Electrical:

Self

Bulk

Self

Body Size Pad Size

(mm)

Inductance Capacitance Resistance

Pkg

(mm)

Lead (nH)

(pF)

0.596

0.583

(mΩ)

13.5

11.1

20 ld 8.9 x 8.9 220 x 220 Longest 2.110

Shortest 1.780

Simulated Results

@ 100 MHz

Amkor’s PLCCs are reliability assured through optimized design,

material and process enabling high performance operation of your

IC chip.

Reliability:

• Moisture sensitivity

characterization

• PCT

• Temp cycle

• Temp/Humidity

• High temp storage

JEDEC Level 3

30 °C/60% - 192 hrs, SAT-192 hrs

121 °C, 2 atm, 100%RH, 504 hours

-65/150 °C, 1000 cycles

85 °C/85% RH, 1000 hours

150 °C, 1000 hours

Applications:

Amkor’s PLCC product family was engi-

neered to meet JEDEC requirements for “J”

leaded surface mount packages. As such,

they take up less board space than equiva-

lent “gull” formed product in the same body

size. Due to the flexibility and performance

offered, most industry circuit types can be

designed into this product. This would

include memory, processors and controllers,

ASIC, DSP, PC chipset, to name a few.

Applications range from consumer through

automotive and aerospace.

VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND

^{TO VIEW THE MOST CURRENT PRODUCT INFORMATION}.

DS293D

Rev Date: 07’03

www.amkor.com

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