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PIMXRT2-8171DVM2A

更新时间: 2024-11-21 01:48:19
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恩智浦 - NXP /
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130页 2076K
描述
i.MX RT1170 Crossover Processors Data Sheet for Industrial Products

PIMXRT2-8171DVM2A 数据手册

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Document Number: IMXRT1170IEC  
Rev. 1, 05/2021  
NXP Semiconductors  
Data Sheet: Technical Data  
MIMXRT1176CVM8A  
MIMXRT1175CVM8A  
MIMXRT1172CVM8A  
MIMXRT117HCVM8A  
MIMXRT1173CVM8A  
MIMXRT1171CVM8A  
MIMXRT117FCVM8A  
i.MX RT1170 Crossover  
Processors Data Sheet  
for Industrial Products  
Package Information  
Plastic Package  
289-pin MAPBGA, 14 x 14 mm, 0.8 mm pitch  
Ordering Information  
See Table 1 on page 6  
1 i.MX RT1170 introduction  
The i.MX RT1170 is a new high-end processor of i.MX  
RT family, which features NXP’s advanced  
implementation of a high performance Arm  
1. i.MX RT1170 introduction . . . . . . . . . . . . . . . . . . . . . . . . 1  
1.1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
1.2. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 6  
1.3. Package marking information . . . . . . . . . . . . . . . 10  
2. Architectural overview . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
2.1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
3. Modules list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
3.1. Special signal considerations . . . . . . . . . . . . . . . 21  
3.2. Recommended connections for unused analog  
®
Cortex -M7 core operating at speeds up to 800 MHz  
®
and a power efficient Cortex -M4 core up to 400 MHz.  
The i.MX RT1170 processor has 2 MB on-chip RAM in  
total, including a 768 KB RAM which can be flexibly  
configured as TCM (512 KB RAM shared with M7 TCM  
and 256 KB RAM shared with M4 TCM) or  
interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23  
4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 25  
4.1. Chip-level conditions . . . . . . . . . . . . . . . . . . . . . . 25  
4.2. System power and clocks . . . . . . . . . . . . . . . . . . 37  
4.3. I/O parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . 47  
4.4. System modules . . . . . . . . . . . . . . . . . . . . . . . . . 55  
4.5. External memory interface . . . . . . . . . . . . . . . . . . 59  
4.6. Display and graphics . . . . . . . . . . . . . . . . . . . . . . 69  
4.7. Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75  
4.8. Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77  
4.9. Communication interfaces . . . . . . . . . . . . . . . . . . 86  
4.10. Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102  
4.11. SNVS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103  
5. Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . 105  
5.1. Boot mode configuration pins . . . . . . . . . . . . . . 105  
5.2. Boot device interface allocation . . . . . . . . . . . . . 105  
6. Package information and contact assignments . . . . . . 111  
6.1. 14 x 14 mm package information . . . . . . . . . . . . 111  
7. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126  
general-purpose on-chip RAM. The i.MX RT1170  
integrates advanced power management module with  
DCDC and LDO regulators that reduce complexity of  
external power supply and simplifies power sequencing.  
The i.MX RT1170 also provides various memory  
interfaces, including SDRAM, RAW NAND FLASH,  
NOR FLASH, SD/eMMC, Quad/Octal SPI, Hyper  
RAM/Flash, and a wide range of other interfaces for  
connecting peripherals, such as WLAN, Bluetooth™,  
GPS, displays, and camera sensors. The i.MX RT1170  
also has rich audio and video features, including MIPI  
CSI/DSI, LCD display, graphic accelerator, camera  
interface, SPDIF, and I2S audio interface.  
NXP reserves the right to change the production detail specifications as may be required  
to permit improvements in the design of its products.  
© 2021 NXP B.V.  

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