Document Number: IMXRT1170IEC
Rev. 1, 05/2021
NXP Semiconductors
Data Sheet: Technical Data
MIMXRT1176CVM8A
MIMXRT1175CVM8A
MIMXRT1172CVM8A
MIMXRT117HCVM8A
MIMXRT1173CVM8A
MIMXRT1171CVM8A
MIMXRT117FCVM8A
i.MX RT1170 Crossover
Processors Data Sheet
for Industrial Products
Package Information
Plastic Package
289-pin MAPBGA, 14 x 14 mm, 0.8 mm pitch
Ordering Information
See Table 1 on page 6
1 i.MX RT1170 introduction
The i.MX RT1170 is a new high-end processor of i.MX
RT family, which features NXP’s advanced
implementation of a high performance Arm
1. i.MX RT1170 introduction . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 6
1.3. Package marking information . . . . . . . . . . . . . . . 10
2. Architectural overview . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3. Modules list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.1. Special signal considerations . . . . . . . . . . . . . . . 21
3.2. Recommended connections for unused analog
®
Cortex -M7 core operating at speeds up to 800 MHz
®
and a power efficient Cortex -M4 core up to 400 MHz.
The i.MX RT1170 processor has 2 MB on-chip RAM in
total, including a 768 KB RAM which can be flexibly
configured as TCM (512 KB RAM shared with M7 TCM
and 256 KB RAM shared with M4 TCM) or
interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 25
4.1. Chip-level conditions . . . . . . . . . . . . . . . . . . . . . . 25
4.2. System power and clocks . . . . . . . . . . . . . . . . . . 37
4.3. I/O parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
4.4. System modules . . . . . . . . . . . . . . . . . . . . . . . . . 55
4.5. External memory interface . . . . . . . . . . . . . . . . . . 59
4.6. Display and graphics . . . . . . . . . . . . . . . . . . . . . . 69
4.7. Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
4.8. Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
4.9. Communication interfaces . . . . . . . . . . . . . . . . . . 86
4.10. Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
4.11. SNVS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
5. Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . 105
5.1. Boot mode configuration pins . . . . . . . . . . . . . . 105
5.2. Boot device interface allocation . . . . . . . . . . . . . 105
6. Package information and contact assignments . . . . . . 111
6.1. 14 x 14 mm package information . . . . . . . . . . . . 111
7. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
general-purpose on-chip RAM. The i.MX RT1170
integrates advanced power management module with
DCDC and LDO regulators that reduce complexity of
external power supply and simplifies power sequencing.
The i.MX RT1170 also provides various memory
interfaces, including SDRAM, RAW NAND FLASH,
NOR FLASH, SD/eMMC, Quad/Octal SPI, Hyper
RAM/Flash, and a wide range of other interfaces for
connecting peripherals, such as WLAN, Bluetooth™,
GPS, displays, and camera sensors. The i.MX RT1170
also has rich audio and video features, including MIPI
CSI/DSI, LCD display, graphic accelerator, camera
interface, SPDIF, and I2S audio interface.
NXP reserves the right to change the production detail specifications as may be required
to permit improvements in the design of its products.
© 2021 NXP B.V.