是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Not Recommended | 零件包装代码: | LCC |
包装说明: | QCCJ, LDCC68,1.0SQ | 针数: | 68 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.31.00.01 | Factory Lead Time: | 28 weeks |
风险等级: | 6.88 | Samacsys Confidence: | 3 |
Samacsys Status: | Released | Samacsys PartID: | 160862 |
Samacsys Pin Count: | 68 | Samacsys Part Category: | Integrated Circuit |
Samacsys Package Category: | Plastic Leaded Chip Carrier | Samacsys Footprint Name: | PLCC68_11 |
Samacsys Released Date: | 2015-04-16 09:48:08 | Is Samacsys: | N |
具有ADC: | YES | 地址总线宽度: | 16 |
位大小: | 8 | CPU系列: | PIC |
最大时钟频率: | 16 MHz | DAC 通道: | NO |
DMA 通道: | NO | 外部数据总线宽度: | 8 |
JESD-30 代码: | S-PQCC-J68 | JESD-609代码: | e3 |
长度: | 24.23 mm | 湿度敏感等级: | 3 |
I/O 线路数量: | 50 | 端子数量: | 68 |
片上程序ROM宽度: | 16 | 最高工作温度: | 70 °C |
最低工作温度: | PWM 通道: | YES | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | QCCJ |
封装等效代码: | LDCC68,1.0SQ | 封装形状: | SQUARE |
封装形式: | CHIP CARRIER | 峰值回流温度(摄氏度): | 245 |
电源: | 5 V | 认证状态: | Not Qualified |
RAM(字节): | 902 | ROM(单词): | 16384 |
ROM可编程性: | OTPROM | 座面最大高度: | 4.57 mm |
速度: | 16 MHz | 子类别: | Microcontrollers |
最大压摆率: | 24 mA | 最大供电电压: | 5.5 V |
最小供电电压: | 4.5 V | 标称供电电压: | 5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子面层: | Matte Tin (Sn) |
端子形式: | J BEND | 端子节距: | 1.27 mm |
端子位置: | QUAD | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 24.23 mm | uPs/uCs/外围集成电路类型: | MICROCONTROLLER, RISC |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
PIC17C756AT-16/L | MICROCHIP |
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PIC17C756A-16I/L | MICROCHIP |
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PIC17C756A-16I/CL | MICROCHIP |
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