是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Not Recommended | 零件包装代码: | SOIC |
包装说明: | SOP, SOP18,.4 | 针数: | 28 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.31.00.01 | Factory Lead Time: | 13 weeks |
风险等级: | 7.36 | 具有ADC: | NO |
地址总线宽度: | 位大小: | 8 | |
CPU系列: | PIC | 最大时钟频率: | 20 MHz |
DAC 通道: | NO | DMA 通道: | NO |
外部数据总线宽度: | JESD-30 代码: | R-PDSO-G18 | |
JESD-609代码: | e3 | 长度: | 11.55 mm |
湿度敏感等级: | 1 | I/O 线路数量: | 16 |
端子数量: | 18 | 片上程序ROM宽度: | 14 |
最高工作温度: | 70 °C | 最低工作温度: | |
PWM 通道: | YES | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | SOP | 封装等效代码: | SOP18,.4 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE |
峰值回流温度(摄氏度): | 260 | 电源: | 3.3/5 V |
认证状态: | Not Qualified | RAM(字节): | 224 |
ROM(单词): | 2048 | ROM可编程性: | FLASH |
座面最大高度: | 2.65 mm | 速度: | 20 MHz |
子类别: | Microcontrollers | 最大压摆率: | 7 mA |
最大供电电压: | 5.5 V | 最小供电电压: | 4.5 V |
标称供电电压: | 5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子面层: | Matte Tin (Sn) | 端子形式: | GULL WING |
端子节距: | 1.27 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 7.5 mm |
uPs/uCs/外围集成电路类型: | MICROCONTROLLER, RISC | Base Number Matches: | 1 |
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