生命周期: | Active | 零件包装代码: | SOIC |
包装说明: | SOIC-28 | 针数: | 28 |
Reach Compliance Code: | compliant | HTS代码: | 8542.31.00.01 |
风险等级: | 5.32 | 具有ADC: | YES |
地址总线宽度: | 位大小: | 8 | |
最大时钟频率: | 20 MHz | DAC 通道: | NO |
DMA 通道: | NO | 外部数据总线宽度: | |
JESD-30 代码: | R-PDSO-G28 | 长度: | 17.93 mm |
I/O 线路数量: | 22 | 端子数量: | 28 |
片上程序ROM宽度: | 14 | 最高工作温度: | 70 °C |
最低工作温度: | PWM 通道: | YES | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | SOP |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE |
RAM(字节): | 128 | ROM(单词): | 2048 |
ROM可编程性: | EPROM | 筛选级别: | TS 16949 |
座面最大高度: | 2.64 mm | 速度: | 2 MHz |
最大供电电压: | 5.5 V | 最小供电电压: | 4.5 V |
标称供电电压: | 5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子形式: | GULL WING | 端子节距: | 1.27 mm |
端子位置: | DUAL | 宽度: | 7.51 mm |
uPs/uCs/外围集成电路类型: | MICROCONTROLLER, RISC |
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