FUSES / SICHERUNGEN
PFMD
Resettable fuses
Typical Time to Trip at 23 ˚C
Surface Mount
PTC-Fuses
100
10
1
Type PFMD
3,4 x 4,7 mm
fast tripping
Packaged per EIA 481-1
PFMD.020.2
Agency recognition:
UL, CSA, TÜV
PFMD.260.2
0.1
PFMD.200.2
PFMD.160.2
PFMD.150.2
PFMD.010.2
PFMD.014.2
0.01
PFMD.125.2
PFMD.110.2
PFMD.030.2
PFMD.075.2
PFMD.050.2
0.001
0.1
1
10
100
50
75
100
Fault current (A)
Dimensions / Abmessungen
Solder pad layouts
C
A
B
D
Applications
Typical Part Marking
•
•
•
•
Hard disk drives
PC motherboards
PC peripherals
Point-of-sale (POS)
equipment
Layout may vary
Part identification
Manufacturer’s
Trademark
•
•
PCMCIA cards
General Electronics
Date code week 1 of 2000 = 0A (year and week)
week 27 of 2000 = A0 (week and year)
Environmental Characteristics
Operating/Storage Temperature / Einsatz/Lagertemp.
Maximum Device Surface Temperature in Tripped State / 125 °C
–40 °C to / bis +85 °C
Passive Aging / passive Alterung
Humidity Aging / Feuchtigkeitsalterung
Thermal Shock / Thermischer Schock
Solvent Resistance / Lösungsmittel-Beständigkeit
Vibration
+85 °C, 1000 hours / Std.
+85 °C, 85% R.H. 1000 hours / Std. ± 5% typ. resist. change
+85 °C to/bis –40 °C, 20 times / Zyklen ± 10% typ. resist. change
MIL-STD-202, Method 215
MIL-STD-883C, Method 2007.1,
Condition A
± 5% typ. resist. change
No change
No change
Test Procedures And Requirements For Model PFMD Series
Test / Test
Test Conditions / Bedingungen
Accept/Reject Criteria
Visual/Mech. / visuell/mech.
Resistance / Widerstand
Time to Trip / Trip-Zeit
Hold Current / Haltestrom
Trip Cycle Life / Trip-Zyklen
Verify dimensions and materials / Kontrolle Abmess./Mat. Per PF physical description
In still air @ 23 °C / bei ruhiger Luft 23 °C
At specified current, Vmax, 23 °C / Bei entspr. Strom
30 min. at Ihold / bei Haltestrom
Rmin ≤ R ≤ Rmax
T ≤ max. time to trip / Trip-Zeit
No trip
(sec.)
Vmax, Imax, 100 cycles / Zyklen
No arcing or burning
No arcing or burning
Trip Endurance / Zeit im Tripzustand Vmax, 48 hours / Stunden
13
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