Datasheet > PF1206S5

PF1206S5

更新时间： 2024-11-29 12:02:51

品牌	Logo	应用领域
PROTEC		/
页数	文件大小	规格书
6页	482K
描述
slow blow chip fuses

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中文翻译

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数据手册

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PF1206S5 数据手册

PF1206S Series

Only One Name Means ProTek’Tion™

Slꢀꢁ blꢀꢁ ꢂhꢃP FuSꢄS

DꢄSꢂRꢃPꢅꢃꢀn

The PF1206S Series are slow blow, high inrush chip fuses that are designed to protect consumer electronics, comput-

ers and telecommincaꢀons equipment and devices from the risk of ﬁre or shock caused by over-currents.

The PF1206S Series is available in a rugged ceramic and glass package. These devices have excellent environmental

performance.

FuSꢄ

ꢆPPlꢃꢂꢆꢅꢃꢀnS

FꢄꢆꢅuRꢄS

• Telecommicaꢀons Equipment - DSL/Cable Modems

• SMART Phones and other Handheld Devices

• Computers - Laptops, Desktops, Servers

• Computer Peripherials - Printers, LCD Panels, Scanners

• Consumer Electronics - DVD Player, MP3/MP4 Players

• High Inrush Current Withstanding Capability

• Compaꢀble with Reﬂow and Wave Solder

• Excellent Environmental Performance

• RoHS & REACH Compliant

• Halogen-Free Material

• Life Test: MIL-STD-202, Method 108D

• Humidity Bias: MIL-STD-202, Method 103

• Moisture Resistance Test: MIL-STD-202, Method 106G

• Thermal Shock: MIL-STD-202, Method 107G

• Terminal Strength: AEC-Q200-006

Mꢄꢂhꢆnꢃꢂꢆl ꢂhꢆRꢆꢂꢅꢄRꢃSꢅꢃꢂS

• Ceramic and Glass Package

• Approximate Weight: 0.009 grams

• Lead-Free

• Board Flex: AEC-Q200-005

• Vibraꢀon: MIL-STD-202, Method 204C

• Mechanical Shock: MIL-STD-202, Method 213C

• Solderability: ANSI/J-STD-002

• Resistance to Solder Heat: MIL-STD-202, Method 210B

• Resistance to Solvents Test: MIL-STD-202, Method 216

• Soldering Method

Wave Soldering: 260°C, 10s Max

Reﬂow Soldering: 260°C, 30s Max

ꢄlꢄꢂꢅRꢃꢂꢆl ꢂhꢆRꢆꢂꢅꢄRꢃSꢅꢃꢂS

ꢆMPꢄRꢄ Rꢆꢅꢃnꢇ

% ꢀF ꢆMP Rꢆꢅꢃnꢇ

ꢀPꢄnꢃnꢇ ꢅꢃMꢄ

4 Hours Minimum

1 ~ 120 Seconds

1A-7A

100%

200%

300%

800%

0.1 ~ 3 Seconds

0.002 ~ 0.05 Seconds

www.protekdevices.com

05424.R0 6/13

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