Datasheet > PF1206F750

PF1206F750

更新时间： 2024-11-08 12:02:51

品牌	Logo	应用领域
PROTEC		/
页数	文件大小	规格书
6页	472K
描述
Fast acting chip fuses

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中文翻译

获取价格

数据手册

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PF1206F750 数据手册

PF1206F Series

Only One Name Means ProTek’Tion™

FꢀSꢁ ꢀꢂꢁꢃnꢄ ꢂhꢃP FuSꢅS

DꢅSꢂRꢃPꢁꢃꢆn

The PF1206F Series are fast acꢀng chip fuses that are designed to protect consumer electronics, computers and tele-

commincaꢀons equipment and devices from the risk of ﬁre or shock caused by over-currents.

The PF1206F Series is available in a rugged ceramic and glass package. These devices have excellent environmental

performance.

FuSꢅ

ꢀPPlꢃꢂꢀꢁꢃꢆnS

FꢅꢀꢁuRꢅS

• Telecommicaꢀons Equipment - DSL/Cable Modems

• SMART Phones and other Handheld Devices

• Computers - Laptops, Desktops, Servers

• Computer Peripherials - Printers, LCD Panels, Scanners

• Consumer Electronics - Digital Cameras, DVR, LCD Televisions, Game

Consoles

• Fast Acꢀng for Excessive Current

• Compaꢀble with Reﬂow and Wave Solder

• Excellent Environmental Performance

• RoHS & REACH Compliant

• Halogen-Free Material

• Life Test: MIL-STD-202, Method 108D

• Humidity Bias: MIL-STD-202, Method 103

• Other - GPS, LED Lighꢀng, Audio Systems

• Moisture Resistance Test: MIL-STD-202, Method 106G

• Thermal Shock: MIL-STD-202, Method 107G

• Terminal Strength: AEC-Q200-006

Mꢅꢂhꢀnꢃꢂꢀl ꢂhꢀRꢀꢂꢁꢅRꢃSꢁꢃꢂS

• Board Flex: AEC-Q200-005

• Vibraꢀon: MIL-STD-202, Method 204C

• Mechanical Shock: MIL-STD-202, Method 213C

• Solderability: MIL-STD-202, Method 208H

• Resistance to Solder Heat: MIL-STD-202, Method 210B

• Ceramic and Glass Package

• Approximate Weight: 0.009 grams

• Lead-Free

• Soldering Method

Wave Soldering: 260°C, 10s Max

Reﬂow Soldering: 260°C, 30s Max

ꢅlꢅꢂꢁRꢃꢂꢀl ꢂhꢀRꢀꢂꢁꢅRꢃSꢁꢃꢂS

ꢀMPꢅRꢅ Rꢀꢁꢃnꢄ

250mA - 8A

% ꢆF ꢀMP Rꢀꢁꢃnꢄ

ꢆPꢅnꢃnꢄ ꢁꢃMꢅ

4 Hours Maximum

5 Seconds Maximum

100%

250%

250mA - 8A

www.protekdevices.com

05418.R0 6/13

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