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PF1015UDF16B PDF预览

PF1015UDF16B

更新时间: 2024-11-19 10:14:07
品牌 Logo 应用领域
KEC /
页数 文件大小 规格书
2页 34K
描述
ESD/EMI Filter

PF1015UDF16B 数据手册

 浏览型号PF1015UDF16B的Datasheet PDF文件第2页 
SEMICONDUCTOR  
PF1015UDF16B  
TECHNICAL DATA  
ESD/EMI Filter  
APPLICATION  
· I/O ESD protection for mobile handsets, notebook, PDAs, etc.  
· EMI filtering for data ports in cell phones, PDAs, notebook computers  
· EMI filtering for LCD, camera and chip-to-chip data lines  
C
A
E
1
8
Pin 1  
GND PAD  
9
16  
FEATURES  
D
TOP VIEW  
BOTTOM VIEW  
· EMI/RFI filtering  
· ESD Protection to IEC 61000-4-2 Level 4  
· Low insertion loss  
DIM MILLIMETERS  
· Good attenuation of high frequency signals  
· Low clamping voltage  
_
A
B
C
D
E
F
3.30 + 0.05  
K
_
1.35 + 0.05  
L
_
2.90 0.10  
+
· Low operating and leakage current  
· Eight elements in one package  
_
0.20 + 0.05  
SIDE VIEW  
0.40  
_
0.40 + 0.10  
1,16 : Filter channel 1  
2,15 : Filter channel 2  
3,14 : Filter channel 3  
4,13 : Filter channel 4  
5,12 : Filter channel 5  
6,11 : Filter channel 6  
7,10 : Filter channel 7  
8,9 : Filter channel 8  
_
0.25 + 0.10  
G
H
J
0.20 Min  
DESCRIPTION  
_
0.50 + 0.05  
PF1015UDF16B is an EMI filter array with electrostatic discharge (ESD) protection,  
which integrates eight pi filters (C-R-C). These parts include ESD protection diodes on  
every pin, providing a very high level of protection for sensitive electronic components  
that may be subjected to electrostatic discharge.  
0.20  
K
L
0.02+0.03/-0.02  
UDFN-16B  
The PF1015UDF16B provides the recommended line termination while implementing a  
low pass filter to limit EMI levels and providing ESD protection which exceeds IEC  
61000-4-2 level 4 standard. The UDFN package is a very effective PCB space  
occupation and a very thin package (0.4mm Pitch, 0.5mm height)  
MARKING  
Type Name  
MAXIMUM RATING (Ta=25)  
CHARACTERISTIC  
DC Power Per Resistor  
SYMBOL  
RATING  
100  
UNIT  
mW  
T3  
PR  
*PD  
Tj  
Lot No.  
Power Dissipation  
800  
Junction Temperature  
150  
RECOMMENEDED FOOTPRINT  
(dimensions in mm)  
Tstg  
Storage Temperature  
-55150  
* Total Package Power Dissipation  
0.40  
0.30  
EQUIVALENT CIRCUIT  
100  
FILTERn*  
FILTERn*  
0.25  
2.20  
15pF  
15pF  
GND  
)
ELECTRICAL CHARACTERISTICS (Ta=25  
CHARACTERISTIC  
Reverse Stand-Off Voltage  
Reverse Breakdown Voltage  
Reverse Leakage Current  
Cutoff Frequency  
SYMBOL  
VRWM  
VBR  
TEST CONDITION  
-
MIN.  
TYP.  
-
MAX.  
UNIT  
V
-
6
5
-
It=1mA  
-
V
IR  
VRWM=3.3V  
-
-
1.0  
-
μA  
MHz  
fc-3dB  
RLINE  
VLine=0V, ZSOURCE=50, ZLOAD=50Ω  
Between Input and Output  
-
110  
100  
45  
30  
Channel Resistance  
80  
36  
24  
120  
54  
36  
VLine=0V DC, 1MHz, Between I/O Pins and GND  
VLine=2.5V, 1MHz, Between I/O Pins and GND  
CLINE  
Line Capacitance  
pF  
2009. 5. 28  
Revision No : 3  
1/2  

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