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PF0603F250 PDF预览

PF0603F250

更新时间: 2024-11-09 12:02:51
品牌 Logo 应用领域
PROTEC /
页数 文件大小 规格书
6页 471K
描述
Fast acting chip fuses

PF0603F250 数据手册

 浏览型号PF0603F250的Datasheet PDF文件第2页浏览型号PF0603F250的Datasheet PDF文件第3页浏览型号PF0603F250的Datasheet PDF文件第4页浏览型号PF0603F250的Datasheet PDF文件第5页浏览型号PF0603F250的Datasheet PDF文件第6页 
PF0603F Series  
Only One Name Means ProTek’Tion™  
FꢀSꢁ ꢀꢂꢁꢃnꢄ ꢂhꢃP FuSꢅS  
DꢅSꢂRꢃPꢁꢃꢆn  
The PF0603F Series are fast acꢀng chip fuses that are designed to protect consumer electronics, computers and tele-  
commincaꢀons equipment and devices from the risk of fire or shock caused by over-currents.  
The PF0603F Series is available in a rugged ceramic and glass package. These devices have excellent environmental  
performance.  
FuSꢅ  
ꢀPPlꢃꢂꢀꢁꢃꢆnS  
FꢅꢀꢁuRꢅS  
• Telecommicaꢀons Equipment - DSL/Cable Modems  
• SMART Phones and other Handheld Devices  
• Computers - Laptops, Desktops, Servers  
• Computer Peripherials - Printers, LCD Panels, Scanners  
• Consumer Electronics - DVD Player, MP3/4 Player  
• Fast Acꢀng for Excessive Current  
• Compaꢀble with Reflow and Wave Solder  
• Excellent Environmental Performance  
• RoHS & REACH Compliant  
• Halogen-Free Material  
• Life Test: MIL-STD-202, Method 108A  
• Humidity Bias: MIL-STD-202, Method 103  
• Moisture Resistance Test: MIL-STD-202, Method 106G  
• Thermal Shock: MIL-STD-202, Method 107G  
• Board Flex: AEC-Q200-005, Appendix 2 (1mm Min)  
• Vibraꢀon: MIL-STD-202, Method 204D  
• Mechanical Shock: MIL-STD-202, Method 213B  
• Solderability: MIL-STD-202, Method 208H  
• Resistance to Solder Heat: MIL-STD-202, Method 210A  
Mꢅꢂhꢀnꢃꢂꢀl ꢂhꢀRꢀꢂꢁꢅRꢃSꢁꢃꢂS  
• Ceramic and Glass Package  
• Approximate Weight: TBA grams  
• Lead-Free  
• Soldering Method  
Wave Soldering: 260°C, 10s Max  
Reflow Soldering: 260°C, 30s Max  
ꢅlꢅꢂꢁRꢃꢂꢀl ꢂhꢀRꢀꢂꢁꢅRꢃSꢁꢃꢂS  
ꢀMPꢅRꢅ Rꢀꢁꢃnꢄ  
250mA - 6A  
% ꢆF ꢀMP Rꢀꢁꢃnꢄ  
ꢆPꢅnꢃnꢄ ꢁꢃMꢅ  
4 Hours Minimum  
5 Seconds Maximum  
100%  
250%  
250mA - 6A  
www.protekdevices.com  
05420.R0 6/13  
Page 1  

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