PD3S160
1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
PowerDI®323
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Features
Mechanical Data
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Guard Ring Die Construction for Transient Protection
High Surge Capability
Lead Free Finish, RoHS Compliant (Note 1)
"Green" Molding Compound (No Br, Sb)
Qualified to AEC-Q101 Standards for High Reliability
Ultra-Small Surface Mount Package
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Case: PowerDI®323
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
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Moisture Sensitivity: Level 1 per J-STD-020D
Polarity: Cathode Band
Terminals: Finish - Matte Tin annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Marking Information: See Page 3
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Ordering Information: See Page 3
Weight: 0.006 grams (approximate)
Top View
Bottom View
Maximum Ratings @T = 25°C unless otherwise specified
A
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic
Symbol
Value
Unit
VRRM
VRWM
VR
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
60
V
RMS Reverse Voltage
42
V
A
VR(RMS)
IF(AV)
Average Forward Current (See also figure 4)
1.0
Non-Repetitive Peak Forward Surge Current 8.3ms
single half sine-wave superimposed on rated load
22
A
IFSM
Thermal Characteristics
Characteristic
Symbol
Typ
⎯
173
125
Max
6
Unit
°C/W
°C/W
°C/W
°C
Thermal Resistance Junction to Soldering Point
Thermal Resistance Junction to Ambient Air (Note 2)
Thermal Resistance Junction to Ambient Air (Note 3)
Operating and Storage Temperature Range
Rθ
JS
Rθ
JA
Rθ
JA
⎯
⎯
-65 to +150
TJ, TSTG
Electrical Characteristics @T = 25°C unless otherwise specified
A
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
Reverse Breakdown Voltage (Note 4)
60
V
V(BR)R
⎯
⎯
IR = 100μA
IF = 0.1A
IF = 0.7A
IF = 1.0A
⎯
⎯
⎯
0.40
0.55
⎯
0.45
0.58
0.64
Forward Voltage
V
VF
0.3
3
5
50
VR = 5V, TA = 25°C
VR = 60V, TA = 25°C
VR = 10V, f = 1.0MHz
⎯
⎯
⎯
Leakage Current (Note 4)
IR
μA
Total Capacitance (See also figure 3)
38
pF
CT
⎯
Notes:
1. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied, see EU Directive 2002/95/EC Annex Notes.
2. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf. TA = 25°C.
3. Polymide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf. TA = 25°C.
4. Short duration pulse test used to minimize self-heating effect.
PowerDI is a registered trademark of Diodes Incorporated.
1 of 3
www.diodes.com
June 2008
© Diodes Incorporated
PD3S160
Document number: DS30899 Rev. 6 - 2