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PCX755BMZFU400LE PDF预览

PCX755BMZFU400LE

更新时间: 2024-09-19 07:11:59
品牌 Logo 应用领域
爱特美尔 - ATMEL /
页数 文件大小 规格书
48页 285K
描述
RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360

PCX755BMZFU400LE 数据手册

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Features  
H 18.1SPECint95, estimates 12.3 SPECfp95 @400Mhz (PC755B)  
H 15.7SPECint95, 9SPECfp95 @350Mhz (PC745B)  
H 733 MIPS @ 400Mhz (PC755B) et 641 MIPS@350Mhz (PC745B)  
H Selectable bus clock (12 CPU bus dividers up to 10x)  
H PD typical 6,4W @ 400Mhz, full operating conditions.  
H Nap, doze and sleep modes for power savings  
H Superscalar (3 instructions per clock cycle) (two instruction + branch)  
H 4 PetaByte virtual memory, 4 Gigabytes of physical memory.  
H 64-bit data and 32-bit address bus interface.  
H 32KB instruction and data cache.  
PowerPC755B/745B  
RISC MICROPRO-  
CESSOR  
H Six independent execution units.  
H Write-back and write-through operations.  
H fint max = 400Mhz (TBC)  
H fbus max = 100Mhz  
H Voltage I/O 1,8V/3,3V ; voltage int 2.0 V  
Preliminary  
Description  
Specification α-site  
PC755B and PC745B PowerPC microprocessors are high-performance, low-power, 32-bit  
implementations of the PowerPC Reduced Instruction Set Computer (RISC) architecture, spe-  
cially enhanced for embedded applications.  
PC755B/745B  
PC755B and PC745B microprocessors differ only in that the PC755B features an enhanced,  
dedicated L2 cache interface with on-chip L2 tags. The PC755B is adrop-inreplacementforthe  
awardwinningPowerPC750TM microprocessorandisfootprintandusersoftwarecodecompat-  
ible with the MPC7400 microprocessor withAltiVec TM technology. The PC745B is a drop-in  
replacement for the PowerPC 740TM microprocessor and is also footprint and user soltware  
code compatible with the PowerPC 603eTM microprocessor. PC755B/745B microprocessors  
provide on-chip debug support and are fully JTAG-compliant.  
The PC745B microprocessor is pin compatible with the TSPC603e family.  
ZF suffix  
ZF suffix  
PBGA255  
Flip-Chip Plastic Ball Grid Array  
PBGA360  
Flip-Chip Plastic Ball Grid Array  
Screening  
This product is manufactured in full compliance with :  
H CBGA upscreenings based upon ATMEL-Grenoblestandards  
H Full military temperature range (Tj=-55oC,+125oC)  
industrial temperature range (Tj=-40oC,+110oC)  
September 2000  
1/48  

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