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PCX750PMGU333LE PDF预览

PCX750PMGU333LE

更新时间: 2024-11-07 18:56:35
品牌 Logo 应用领域
爱特美尔 - ATMEL 时钟外围集成电路
页数 文件大小 规格书
42页 304K
描述
RISC Microprocessor, 32-Bit, 333MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

PCX750PMGU333LE 技术参数

生命周期:Obsolete零件包装代码:BGA
包装说明:BGA,针数:360
Reach Compliance Code:unknownECCN代码:3A001.A.2.C
HTS代码:8542.31.00.01风险等级:5.68
地址总线宽度:32位大小:32
边界扫描:YES最大时钟频率:100 MHz
外部数据总线宽度:64格式:FLOATING POINT
集成缓存:YESJESD-30 代码:S-CBGA-B360
长度:25 mm低功率模式:YES
端子数量:360最高工作温度:125 °C
最低工作温度:-55 °C封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装代码:BGA封装形状:SQUARE
封装形式:GRID ARRAY认证状态:Not Qualified
座面最大高度:3.2 mm速度:333 MHz
最大供电电压:2 V最小供电电压:1.8 V
标称供电电压:1.9 V表面贴装:YES
技术:CMOS温度等级:MILITARY
端子形式:BALL端子节距:1.27 mm
端子位置:BOTTOM宽度:25 mm
uPs/uCs/外围集成电路类型:MICROPROCESSOR, RISCBase Number Matches:1

PCX750PMGU333LE 数据手册

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Features  
H 12.4SPECint95,8.4SPECfp95 @266Mhz (750P)  
w/1MB L2 @133Mhz  
H 13.5SPECint95, 9SPECfp95 @300Mhz (740P)  
H 488 MIPS @ 266Mhz  
H Selectable bus clock (11 CPU bus dividers up to 8x)  
H PD typical 4,2W @ 333Mhz, full operating conditions.  
H Nap, doze and sleep modes for power savings  
H Superscalar (3 instructions per clock cycle)  
H 4G-Byte direct addressing range.  
PCX750P/740P  
H 64-bit data and 32-bit address bus interface.  
H 32KB instruction and data cache.  
PowerPC750P/740P  
H Six independent execution units and two register files.  
H Write-back and write-through operations.  
H fint max = 333Mhz  
RISC MICROPRO-  
CESSOR  
H fbus max = 100Mhz  
H Compatible CMOS input / TTL output  
Family  
Description  
Pid8t-750P/740P  
Specification  
The PCX750P and PCX740P microprocessor (after named 750P/740P) are low-power imple-  
mentations of the PowerPC Reduced Instruction Set Computer (RISC) architecture.  
The 750P/740P microprocessors designs are superscalar, capable of issuing three instructions  
per clock cycle into six independent execution units  
The 740P/750Pmicroprocessorsusesa1,9/3,3-voltsCMOSprocesstechnologyandmaintains  
full interface compatibility with TTL devices.  
The 750P/740P provides four software controlable power-saving modes and a thermal assist  
unit management.  
Preliminary  
The 750P/740P microprocessors have separate 32-Kbyte, physically-addressed instruction  
and data caches and differ only in that the 750P features a dedicated L2 cache interface with  
on-chip L2 tags.  
Botharesoftwareandbus-compatiblewiththePowerPC603andPowerPC604families, andare  
fully JTAG compliant.  
The 740P microprocessor is pin compatible with the TSPC603e family.  
G suffix  
GS suffix  
CBGA255 and CBGA360  
CI-CGA255 and CI-CGA360  
Ceramic Ball Grid Array  
Ceramic Ball Grid Array  
with Solder Column Interposer (SCI)  
Screening  
This product is manufactured in full compliance with :  
H CBGA upscreenings based upon ATMEL-Grenoblestandards  
H Full military temperature range (Tc=-55oC,+125oC)  
industrial temperature range (Tc=-40oC,+110oC)  
August 2000  
1/42  
H CI-CGA versions of 740P and 750P (TBC)  

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