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PCF2123U/10AA PDF预览

PCF2123U/10AA

更新时间: 2024-11-20 07:03:35
品牌 Logo 应用领域
恩智浦 - NXP 计时器或实时时钟微控制器和处理器外围集成电路
页数 文件大小 规格书
55页 1042K
描述
SPI Real time clock/calendar

PCF2123U/10AA 技术参数

生命周期:Active包装说明:DIE,
Reach Compliance Code:unknown风险等级:5.66
Is Samacsys:N其他特性:SEATED HGT-NOM
信息访问方法:SERIAL, 3-WIREJESD-30 代码:R-XUUC-N12
长度:1.492 mm端子数量:12
计时器数量:1最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:UNSPECIFIED
封装代码:DIE封装形状:RECTANGULAR
封装形式:UNCASED CHIP座面最大高度:0.2 mm
最大供电电压:5.5 V最小供电电压:1.1 V
标称供电电压:1.8 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:NO LEAD端子位置:UPPER
宽度:1.449 mmuPs/uCs/外围集成电路类型:TIMER, REAL TIME CLOCK
Base Number Matches:1

PCF2123U/10AA 数据手册

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PCF2123  
SPI Real time clock/calendar  
Rev. 02 — 4 December 2009  
Product data sheet  
1. General description  
The PCF2123 is a CMOS1 Real-Time Clock (RTC) and calendar optimized for low power  
applications. Data is transferred serially via a Serial Peripheral Interface (SPI-bus) with a  
maximum data rate of 6.25 Mbit/s. An alarm and timer function is also available providing  
the possibility to generate a wake-up signal on an interrupt pin. An offset register allows  
fine tuning of the clock.  
2. Features  
I Real time clock provides year, month, day, weekday, hours, minutes, and seconds  
based on a 32.768 kHz quartz crystal  
I Low backup current while running: typical 100 nA at VDD = 2.0 V and Tamb = 25 °C  
I Resolution: seconds to years  
I Watchdog functionality  
I Freely programmable timer and alarm with interrupt capability  
I Clock operating voltage: 1.1 V to 5.5 V  
I 3 line SPI-bus with separate, but combinable data input and output  
I Serial interface at VDD = 1.6 V to 5.5 V  
I 1 second or 1 minute interrupt output  
I Integrated oscillator load capacitors for CL = 7 pF  
I Internal Power-On Reset (POR)  
I Open-drain interrupt and clock output pins  
I Programmable offset register for frequency adjustment  
3. Applications  
I Time keeping application  
I Battery powered devices  
I Metering  
I High duration timers  
I Daily alarms  
I Low standby power applications  
1. The definition of the abbreviations and acronyms used in this data sheet can be found in Section 19.  

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