PCA9555DB/G,118 PDF预览

PCA9555DB/G,118

更新时间: 2025-07-16 18:52:11
品牌 Logo 应用领域
恩智浦 - NXP PC光电二极管外围集成电路
页数 文件大小 规格书
34页 183K
描述
PCA9555 - 16-bit I2C-bus and SMBus I/O port with interrupt SSOP2 24-Pin

PCA9555DB/G,118 技术参数

Source Url Status Check Date:2013-06-14 00:00:00是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:SSOP2
包装说明:SSOP, SSOP24,.3针数:24
Reach Compliance Code:unknown风险等级:5.28
JESD-30 代码:R-PDSO-G24长度:8.2 mm
位数:16I/O 线路数量:16
端口数量:2端子数量:24
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:SSOP
封装等效代码:SSOP24,.3封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, SHRINK PITCH电源:2.5/5 V
认证状态:Not Qualified座面最大高度:2 mm
子类别:Parallel IO Port最大供电电压:5.5 V
最小供电电压:2.3 V标称供电电压:3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:GULL WING
端子节距:0.65 mm端子位置:DUAL
宽度:5.3 mmuPs/uCs/外围集成电路类型:PARALLEL IO PORT, GENERAL PURPOSE
Base Number Matches:1

PCA9555DB/G,118 数据手册

 浏览型号PCA9555DB/G,118的Datasheet PDF文件第25页浏览型号PCA9555DB/G,118的Datasheet PDF文件第26页浏览型号PCA9555DB/G,118的Datasheet PDF文件第27页浏览型号PCA9555DB/G,118的Datasheet PDF文件第29页浏览型号PCA9555DB/G,118的Datasheet PDF文件第30页浏览型号PCA9555DB/G,118的Datasheet PDF文件第31页 
PCA9555  
NXP Semiconductors  
16-bit I2C-bus and SMBus I/O port with interrupt  
14. Handling information  
All input and output pins are protected against ElectroStatic Discharge (ESD) under  
normal handling. When handling ensure that the appropriate precautions are taken as  
described in JESD625-A or equivalent standards.  
15. Soldering of SMD packages  
This text provides a very brief insight into a complex technology. A more in-depth account  
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow  
soldering description”.  
15.1 Introduction to soldering  
Soldering is one of the most common methods through which packages are attached to  
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both  
the mechanical and the electrical connection. There is no single soldering method that is  
ideal for all IC packages. Wave soldering is often preferred when through-hole and  
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not  
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high  
densities that come with increased miniaturization.  
15.2 Wave and reflow soldering  
Wave soldering is a joining technology in which the joints are made by solder coming from  
a standing wave of liquid solder. The wave soldering process is suitable for the following:  
Through-hole components  
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board  
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless  
packages which have solder lands underneath the body, cannot be wave soldered. Also,  
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,  
due to an increased probability of bridging.  
The reflow soldering process involves applying solder paste to a board, followed by  
component placement and exposure to a temperature profile. Leaded packages,  
packages with solder balls, and leadless packages are all reflow solderable.  
Key characteristics in both wave and reflow soldering are:  
Board specifications, including the board finish, solder masks and vias  
Package footprints, including solder thieves and orientation  
The moisture sensitivity level of the packages  
Package placement  
Inspection and repair  
Lead-free soldering versus SnPb soldering  
15.3 Wave soldering  
Key characteristics in wave soldering are:  
© NXP B.V. 2009. All rights reserved.  
PCA9555_8  
Product data sheet  
Rev. 08 — 22 October 2009  
28 of 34  
 
 
 
 
 

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