是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | LBGA, BGA196,14X14,40 | 针数: | 196 |
Reach Compliance Code: | compliant | HTS代码: | 8542.31.00.01 |
风险等级: | 5.79 | 地址总线宽度: | |
边界扫描: | YES | 总线兼容性: | PCI |
最大时钟频率: | 25 MHz | 数据编码/解码方法: | NRZ; NRZI; BIPH-LEVEL(MANCHESTER) |
最大数据传输速率: | 125 MBps | 外部数据总线宽度: | |
JESD-30 代码: | S-PBGA-B196 | JESD-609代码: | e1 |
长度: | 15 mm | 低功率模式: | YES |
串行 I/O 数: | 1 | 端子数量: | 196 |
最高工作温度: | 70 °C | 最低工作温度: | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | LBGA |
封装等效代码: | BGA196,14X14,40 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, LOW PROFILE | 峰值回流温度(摄氏度): | 260 |
电源: | 1.2,2.5,3.3 V | 认证状态: | Not Qualified |
座面最大高度: | 1.6 mm | 子类别: | Serial IO/Communication Controllers |
最大供电电压: | 1.26 V | 最小供电电压: | 1.14 V |
标称供电电压: | 1.2 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) | 端子形式: | BALL |
端子节距: | 1 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 15 mm |
uPs/uCs/外围集成电路类型: | SERIAL IO/COMMUNICATION CONTROLLER, LAN | Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
RC82573E | INTEL |
功能相似 |
LAN Controller, 1 Channel(s), 125MBps, CMOS, PBGA196, 15 X 15 MM, 1 MM, PITCH, TFBGA-196 |
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