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PC3Q67Q PDF预览

PC3Q67Q

更新时间: 2024-09-17 22:14:39
品牌 Logo 应用领域
夏普 - SHARP 光电输出元件
页数 文件大小 规格书
5页 69K
描述
Mini-falt Package, General Purpose Half Pitch Photocoupler

PC3Q67Q 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:MINIFLAT-4Reach Compliance Code:unknown
风险等级:5.82Is Samacsys:N
其他特性:UL RECOGNIZED, VDE APPROVEDColl-Emtr Bkdn Voltage-Min:80 V
配置:SEPARATE, 4 CHANNELS标称电流传输比:50%
最大暗电源:100 nA最大正向电流:0.05 A
最大绝缘电压:2500 VJESD-609代码:e0
元件数量:4最高工作温度:100 °C
最低工作温度:-30 °C光电设备类型:TRANSISTOR OUTPUT OPTOCOUPLER
端子面层:Tin/Lead (Sn/Pb)Base Number Matches:1

PC3Q67Q 数据手册

 浏览型号PC3Q67Q的Datasheet PDF文件第2页浏览型号PC3Q67Q的Datasheet PDF文件第3页浏览型号PC3Q67Q的Datasheet PDF文件第4页浏览型号PC3Q67Q的Datasheet PDF文件第5页 
PC3H7/PC3Q67Q  
Mini-falt Package, General  
Purpose Half Pitch  
Photocoupler  
PC3H7/PC3Q67Q  
Features  
Outline Dimensions  
(Unit : mm)  
Anode mark  
1. Mini-flat package  
PC3H7  
2. Half pitch type (lead pitch : 1.27mm)  
3. Isolation voltage (Viso : 2 500Vrms)  
4. Applicable to infrared ray reflow (230˚C, for MAX. 30s)  
5. High reliability  
1
4
3
S
2
3 H 7  
4.4±0.2  
6. Taping package PC3H7 (1ch) PC3Q67Q (4ch)  
7. Recognized by UL, file No. E64380  
Approved by VDE, No.5922UG  
5.3±0.3  
(1.7)  
Epoxy resin  
Applications  
1. Programmable controllers  
+0.4  
0.5  
0.2  
Parting line  
+0.2  
Package Specifications  
7.0  
0.7  
Model No.  
PC3H7  
PC3Q67Q  
Taping specifications  
Taping reel diameter 330mm (3 000pcs.)  
Taping reel diameter 330mm (1 000pcs.)  
( ) : Reference dimensions  
Internal connection diagram  
4
3
2
9
1
2
3
4
Anode  
Cathode  
Emitter  
Collector  
Absolute Maximum Ratings  
(Ta=25˚C)  
Unit  
mA  
A
Parameter  
Symbol  
Rating  
50  
1
Forward current  
IF  
PC3Q67Q  
*1Peak forward current  
Reverse voltage  
IFM  
1
±0.3  
10.3  
VR  
6
V
±0.25  
16  
1.27  
Model No.  
Power dissipation  
P
70  
mW  
V
Collector-emitter  
voltage  
PC3H7  
VCEO  
70  
PC3Q67Q VCEO  
35  
V
Primary  
Side  
mark  
Emitter-collector voltage  
Collector current  
VECO  
IC  
6
V
50  
mA  
mW  
mW  
kVrms  
Collector power dissipation  
Total power dissipation  
*2Isolation voltage  
PC  
150  
170  
2.5  
±0.1  
0.4  
C0.4  
Ptot  
Viso  
Topr  
Tstg  
Tsol  
1
8
±0.3  
5.3  
Epoxy resin  
Operating temperature  
Storage temperature  
*3Soldering temperature  
30 to +100  
40 to +125  
260  
˚C  
˚C  
˚C  
+0.4  
0.5  
0.2  
+0.2  
*1 Pulse width<=100µs, Duty ratio : 0.001  
*2 AC for 1min, 40 to 60%RH, f=60Hz  
*3 For 10s  
7.0  
6°  
Internal connection diagram  
0.7  
1
3
5
7
8
16  
15  
14  
13  
12  
11  
10  
9
Anode  
2
4 6  
Cathode  
9
11 13 15  
Emitter  
10 12 14 16  
1
2
3
4
5
6
7
8
Collector  
Soldering area  
Notice  
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP  
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.  
Internet Internet address for Electronic Components Group http://www.sharp.co.jp/ecg/  

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