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PC28F256G18FE PDF预览

PC28F256G18FE

更新时间: 2024-01-26 01:20:49
品牌 Logo 应用领域
镁光 - MICRON 存储
页数 文件大小 规格书
118页 1154K
描述
128Mb, 256Mb, 512Mb, 1Gb StrataFlash Memory

PC28F256G18FE 数据手册

 浏览型号PC28F256G18FE的Datasheet PDF文件第2页浏览型号PC28F256G18FE的Datasheet PDF文件第3页浏览型号PC28F256G18FE的Datasheet PDF文件第4页浏览型号PC28F256G18FE的Datasheet PDF文件第5页浏览型号PC28F256G18FE的Datasheet PDF文件第6页浏览型号PC28F256G18FE的Datasheet PDF文件第7页 
128Mb, 256Mb, 512Mb, 1Gb StrataFlash Memory  
Features  
Micron StrataFlash Embedded Memory  
P/N – PC28F128G18xx  
P/N – PC28F256G18xx  
P/N – PC28F512G18xx  
P/N – PC28F00AG18xx  
• Power  
– Core voltage: 1.7 V - 2.0 V  
– I/O voltage: 1.7 V - 2.0 V  
– Standby current: 60 μA (typ) for 512-Mbit, 65 nm  
– Deep Power-Down mode: 2 μA (typ)  
– Automatic Power Savings mode  
– 16-word synchronous-burst read current: 23 mA  
(typ) @ 108 MHz; 24 mA (typ) @ 133 MHz  
• Software  
Features  
• High-Performance Read, Program and Erase  
– 96 ns initial read access  
– 108 MHz with zero wait-state synchronous burst  
reads: 7 ns clock-to-data output  
– 133 MHz with zero wait-state synchronous burst  
reads: 5.5 ns clock-to-data output  
– 8-, 16-, and continuous-word synchronous-burst  
Reads  
– Programmable WAIT configuration  
– Customer-configurable output driver impedance  
– Buffered Programming: 2.0 μs/Word (typ), 512-  
Mbit 65 nm  
– Micron® Flash data integrator (FDI) optimized  
– Basic command set (BCS) and extended com-  
mand set (ECS) compatible  
– Common Flash interface (CFI) capable  
• Security  
– Block Erase: 0.9 s per block (typ)  
20 μs (typ) program/erase suspend  
• Architecture  
– 16-bit wide data bus  
– Multi-Level Cell Technology  
– One-time programmable (OTP) space  
64 unique factory device identifier bits  
2112 user-programmable OTP bits  
– Absolute write protection: VPP = GND  
– Power-transition erase/program lockout  
– Individual zero latency block locking  
– Individual block lock-down  
– Symmetrically-Blocked Array Architecture  
– 256-Kbyte Erase Blocks  
– 1-Gbit device: Eight 128-Mbit partitions  
– 512-Mbit device: Eight 64-Mbit partitions  
– 256-Mbit device: Eight 32-Mbit partitions  
– 128-Mbit device: Eight 16-Mbit partitions  
– Read-While-Program and Read-While-Erase  
– Status Register for partition/device status  
– Blank Check feature  
• Density and packaging  
– 128Mb, 256Mb, 512Mbit, and 1-Gbit  
– Address-data multiplexed and non-multiplexed  
interfaces  
– 64-Ball Easy BGA  
• Quality and Reliability  
– Expanded temperature: –30 °C to +85 °C  
– Minimum 100,000 erase cycles per block  
– 65nm Process Technology  
PDF: 09005aef8448483a  
128_256_512_65nm_g18.pdf - Rev. F 8/11 EN  
Micron Technology, Inc. reserves the right to change products or specifications without notice.  
1
© 2011 Micron Technology, Inc. All rights reserved.  
Products and specifications discussed herein are subject to change by Micron without notice.  

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