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PC28F00BP30EFA PDF预览

PC28F00BP30EFA

更新时间: 2024-11-09 12:27:51
品牌 Logo 应用领域
镁光 - MICRON 闪存内存集成电路
页数 文件大小 规格书
86页 11765K
描述
Numonyx® Axcell™ P30-65nm Flash Memory

PC28F00BP30EFA 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:BGA
包装说明:TBGA, BGA64,8X8,40针数:64
Reach Compliance Code:compliantECCN代码:3A991.B.1.A
HTS代码:8542.32.00.51风险等级:5.79
Is Samacsys:N最长访问时间:105 ns
其他特性:SYMMETRICAL BLOCKS命令用户界面:YES
通用闪存接口:YES数据轮询:NO
JESD-30 代码:R-PBGA-B64JESD-609代码:e1
长度:10 mm内存密度:2147483648 bit
内存集成电路类型:FLASH内存宽度:16
功能数量:1部门数/规模:2K
端子数量:64字数:134217728 words
字数代码:128000000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:128MX16封装主体材料:PLASTIC/EPOXY
封装代码:TBGA封装等效代码:BGA64,8X8,40
封装形状:RECTANGULAR封装形式:GRID ARRAY, THIN PROFILE
页面大小:16 words并行/串行:PARALLEL
峰值回流温度(摄氏度):260电源:1.8,1.8/3.3 V
编程电压:3 V认证状态:Not Qualified
座面最大高度:1.2 mm部门规模:64K
最大待机电流:0.00048 A子类别:Flash Memories
最大压摆率:0.031 mA最大供电电压 (Vsup):2 V
最小供电电压 (Vsup):1.7 V标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:BALL端子节距:1 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:30
切换位:NO类型:NOR TYPE
宽度:8 mmBase Number Matches:1

PC28F00BP30EFA 数据手册

 浏览型号PC28F00BP30EFA的Datasheet PDF文件第2页浏览型号PC28F00BP30EFA的Datasheet PDF文件第3页浏览型号PC28F00BP30EFA的Datasheet PDF文件第4页浏览型号PC28F00BP30EFA的Datasheet PDF文件第5页浏览型号PC28F00BP30EFA的Datasheet PDF文件第6页浏览型号PC28F00BP30EFA的Datasheet PDF文件第7页 
Numonyx® Axcell™ P30-65nm Flash Memory  
512-Mbit, 1-Gbit , 2-Gbit  
Datasheet  
Product Features  
„ High performance:  
„ Enhanced Security:  
— Absolute write protection: VPP = VSS  
— Power-transition erase/program lockout  
— Individual zero-latency block locking  
— Individual block lock-down capability  
— Password Access feature  
Easy BGA:  
— 100ns initial access time (512-Mbit, 1-Gbit)  
— 105ns initial access time (2-Gbit)  
— 25ns 16-word asynchronous-page read mode  
— 52MHz with zero WAIT states, 17ns clock-to-  
data output synchronous-burst read mode  
— 4-, 8-, 16- and continuous-word options for  
burst mode  
— One-Time Programmable Register:  
— 64 OTP bits, programmed with unique  
information by Numonyx  
— 2112 OTP bits, available for customer  
programming  
TSOP:  
— 110ns initial access time  
„ Software:  
Easy BGA and TSOP:  
— Buffered Enhanced Factory Programming at  
2.0MByte/s (typ) using 512-word buffer  
— 1.8V buffered programming at 1.46MByte/s  
(Typ) using 512-word buffer  
— 25µs (Typ) program suspend  
— 30µs (Typ) erase suspend  
®
— Numonyx Flash Data Integrator optimized  
— Basic Command Set and Extended Function  
Interface (EFI) Command Set compatible  
— Common Flash Interface capable  
„ Architecture:  
— Multi-Level Cell Technology: Highest Density  
at Lowest Cost  
„ Density and Packaging  
— Symmetrically-blocked architecture (512-  
Mbit, 1-Gbit, 2-Gbit)  
— 56-Lead TSOP (512-Mbit, 1-Gbit)  
— 64-Ball Easy BGA (512-Mbit, 1-Gbit, 2-Gbit)  
— 16-bit wide data bus  
— Asymmetrically-blocked architecture, Four 32-  
KByte parameter blocks: Top or Bottom  
configuration (512-Mbit, 1-Gbit)  
— 128-KByte array blocks  
„ Quality and Reliability  
— JESD47E Compliant  
— Blank Check to verify an erase block  
— Operating temperature: –40°C to +85°C  
— Minimum 100,000 erase cycles  
— 65nm process technology  
„ Voltage and Power:  
— VCC (core) voltage: 1.7V – 2.0V  
— VCCQ (I/O) voltage: 1.7V – 3.6V  
— Standby current: 70µA(Typ) for 512-Mbit,  
75µA(Typ) for 1-Gbit  
— Continuous synchronous read current (Easy  
BGA): 21mA (Typ)/24mA (Max) at 52MHz  
Datasheet  
1
Sept 2012  
Order Number: 208042-06  

PC28F00BP30EFA 替代型号

型号 品牌 替代类型 描述 数据表
RC28F00BM29EWHA MICRON

类似代替

Parallel NOR Flash Embedded Memory
PC28F00BM29EWHA MICRON

类似代替

Parallel NOR Flash Embedded Memory
S70GL02GS11FHI020 SPANSION

功能相似

Flash, 128MX16, 110ns, PBGA64, 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64

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