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PC28F00AP30TFA PDF预览

PC28F00AP30TFA

更新时间: 2024-11-06 12:27:51
品牌 Logo 应用领域
镁光 - MICRON 闪存内存集成电路
页数 文件大小 规格书
86页 11765K
描述
Numonyx® Axcell™ P30-65nm Flash Memory 512-Mbit, 1-Gbit , 2-Gbit

PC28F00AP30TFA 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Obsolete零件包装代码:BGA
包装说明:TBGA, BGA64,8X8,40针数:64
Reach Compliance Code:compliantECCN代码:3A991.B.1.A
HTS代码:8542.32.00.51风险等级:8.5
Is Samacsys:N最长访问时间:100 ns
其他特性:TOP BOOT启动块:TOP
命令用户界面:YES通用闪存接口:YES
数据轮询:NOJESD-30 代码:R-PBGA-B64
JESD-609代码:e1长度:10 mm
内存密度:1073741824 bit内存集成电路类型:FLASH
内存宽度:16功能数量:1
部门数/规模:4,1023端子数量:64
字数:67108864 words字数代码:64000000
工作模式:SYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:64MX16
封装主体材料:PLASTIC/EPOXY封装代码:TBGA
封装等效代码:BGA64,8X8,40封装形状:RECTANGULAR
封装形式:GRID ARRAY, THIN PROFILE页面大小:16 words
并行/串行:PARALLEL峰值回流温度(摄氏度):260
电源:1.8,1.8/3.3 V编程电压:3 V
认证状态:Not Qualified座面最大高度:1.2 mm
部门规模:16K,64K最大待机电流:0.00024 A
子类别:Flash Memories最大压摆率:0.031 mA
最大供电电压 (Vsup):2 V最小供电电压 (Vsup):1.7 V
标称供电电压 (Vsup):1.8 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:BALL
端子节距:1 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:30切换位:NO
类型:NOR TYPE宽度:8 mm
Base Number Matches:1

PC28F00AP30TFA 数据手册

 浏览型号PC28F00AP30TFA的Datasheet PDF文件第2页浏览型号PC28F00AP30TFA的Datasheet PDF文件第3页浏览型号PC28F00AP30TFA的Datasheet PDF文件第4页浏览型号PC28F00AP30TFA的Datasheet PDF文件第5页浏览型号PC28F00AP30TFA的Datasheet PDF文件第6页浏览型号PC28F00AP30TFA的Datasheet PDF文件第7页 
Numonyx® Axcell™ P30-65nm Flash Memory  
512-Mbit, 1-Gbit , 2-Gbit  
Datasheet  
Product Features  
„ High performance:  
„ Enhanced Security:  
— Absolute write protection: VPP = VSS  
— Power-transition erase/program lockout  
— Individual zero-latency block locking  
— Individual block lock-down capability  
— Password Access feature  
Easy BGA:  
— 100ns initial access time (512-Mbit, 1-Gbit)  
— 105ns initial access time (2-Gbit)  
— 25ns 16-word asynchronous-page read mode  
— 52MHz with zero WAIT states, 17ns clock-to-  
data output synchronous-burst read mode  
— 4-, 8-, 16- and continuous-word options for  
burst mode  
— One-Time Programmable Register:  
— 64 OTP bits, programmed with unique  
information by Numonyx  
— 2112 OTP bits, available for customer  
programming  
TSOP:  
— 110ns initial access time  
„ Software:  
Easy BGA and TSOP:  
— Buffered Enhanced Factory Programming at  
2.0MByte/s (typ) using 512-word buffer  
— 1.8V buffered programming at 1.46MByte/s  
(Typ) using 512-word buffer  
— 25µs (Typ) program suspend  
— 30µs (Typ) erase suspend  
®
— Numonyx Flash Data Integrator optimized  
— Basic Command Set and Extended Function  
Interface (EFI) Command Set compatible  
— Common Flash Interface capable  
„ Architecture:  
— Multi-Level Cell Technology: Highest Density  
at Lowest Cost  
„ Density and Packaging  
— Symmetrically-blocked architecture (512-  
Mbit, 1-Gbit, 2-Gbit)  
— 56-Lead TSOP (512-Mbit, 1-Gbit)  
— 64-Ball Easy BGA (512-Mbit, 1-Gbit, 2-Gbit)  
— 16-bit wide data bus  
— Asymmetrically-blocked architecture, Four 32-  
KByte parameter blocks: Top or Bottom  
configuration (512-Mbit, 1-Gbit)  
— 128-KByte array blocks  
„ Quality and Reliability  
— JESD47E Compliant  
— Blank Check to verify an erase block  
— Operating temperature: –40°C to +85°C  
— Minimum 100,000 erase cycles  
— 65nm process technology  
„ Voltage and Power:  
— VCC (core) voltage: 1.7V – 2.0V  
— VCCQ (I/O) voltage: 1.7V – 3.6V  
— Standby current: 70µA(Typ) for 512-Mbit,  
75µA(Typ) for 1-Gbit  
— Continuous synchronous read current (Easy  
BGA): 21mA (Typ)/24mA (Max) at 52MHz  
Datasheet  
1
Sept 2012  
Order Number: 208042-06  

PC28F00AP30TFA 替代型号

型号 品牌 替代类型 描述 数据表
RC28F00AP30TFA MICRON

完全替代

65nm; MLC; 28F512P30B/E/TF, 28F00AP30B/E/TF, 28F00BP30EF

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