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PAN1323 PDF预览

PAN1323

更新时间: 2024-09-24 12:52:55
品牌 Logo 应用领域
松下 - PANASONIC 蓝牙
页数 文件大小 规格书
2页 1154K
描述
SERIES BLUETOOTH HIGH TEMPERATURE MODULES

PAN1323 数据手册

 浏览型号PAN1323的Datasheet PDF文件第2页 
®
NEW! PAN1323 SERIES BLUETOOTH HIGH TEMPERATURE MODULES  
Three Standards, One Small Module!  
One highly flexible RF Module, three popular standards: Bluetooth Classic,  
Bluetooth Low Energy and ANT™. Panasonic introduces the NEW PAN1323  
Series Triple Mode RF Module with embedded antenna. The PAN1323 Series  
provides easily integrated Bluetooth Version 4.0 and ANT connectivity into new  
and current designs by removing RF design and certification barriers from the  
development of the application. Gain unprecedented access using this three  
mode gateway module that can connect 14 Million ANT nodes to over 3 Billion  
Bluetooth nodes. Use Bluetooth EDR to manage large data requirements while  
taking advantage of extraordinary battery life using ultra lower network technology  
found in Bluetooth Low Energy and ANT for small data loads.  
Designers can reduce the size and cost of applications using Panasonic’s unique,  
tiny footprint technology. Just 85.5 mm2, this family of modules are designed to  
accommodate PCBs with pad pitch of 1.3mm with as little as two layers for easy  
implementation and manufacturing. PAN1323 Series Modules have a Bluetooth  
subsystem, FCC, CE, (ETSI) and IC certifications.  
The NEW PAN1323 Series is based upon Texas Instrument’s CC256x integrated circuits and uses a host controlled interface  
(HCI), a cost effective and flexible means to implement a Bluetooth network. HCI reduces BOM cost by eliminating redundant  
processing capacity and giving designers the flexibility to work with a controller of their choosing, as the stacks reside  
and execute on the application’s host processor. The PAN1323 Series is pad compatible with Panasonic’s PAN1325A,  
PAN1326 and PAN1327 Series. A single PCB layout allows the flexibility of different protocol functionality implemented with  
only firmware.  
Product Performance:  
• A Single Module for Three Standards: Bluetooth Classic,  
Bluetooth Low Energy and ANT™.  
Easily Integrates to Texas Instruments’ MSP430  
and Stellaris ARM7 Controllers  
o Bluetooth Version 4.0  
Small Footprint: 9mm x 9.5mm x 1.8mm  
Fully Certified, Bluetooth v4.0, FCC, CE and IC  
Complete Development Environment  
100% Footprint Compatible with PAN13xx Series  
Industrial Temperature Rating -40ºC to +85 ºC  
Supports All Bluetooth Profiles  
o ANT™ is a wireless sensor network protocol  
designed for ultra-low power applications  
o Bluetooth Low Energy average power consumption  
is about 1 uA.  
Cost Effective and Flexible HCI Interface  
Extraordinary Range with10 dbm of Tx Power  
Compatible with 14 Million Deployed ANT Nodes  
PAN1323 Part Number:  
Part Numbers  
Description  
ENW–89842A2KF  
Bluetooth, PAN1323 , Triple Mode with Antenna  
Development and Evaluation Part Numbers:  
Part Numbers  
ENW-89825A2JF  
EVAL_PAN1323  
®
Description  
PAN1323ETU, Development Module for PAN1315, PAN1316, PAN1317, PAN1325, PAN1326, PAN1327  
EVAL_PAN1323, Development Kit for PAN1315, PAN1316, PAN1317, PAN1325, PAN1326, PAN1327  
The Bluetooth word mark and logos are registered trademarks owned by Bluetooth SIG, Inc. and any use of such marks by  
Panasonic Corporation of North America is under license. Other trademarks and trade names are those of their respective owners.  
www.panasonic.com/rfmodules  
industrial@us.panasonic.com  
1-800-344-2112  
Copyright © 2013 Panasonic Corporation of North America.  
All Rights Reserved. Specifications are subject to change without notice.  
PAN13xx High Temp Line Extension, FY12-160-XXX  

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