5秒后页面跳转
捷配首页

Datasheet > 可编程逻辑 > 可编程逻辑器件> PAL16R6A-2MJB
PAL16R6A-2MJB PDF预览

PAL16R6A-2MJB

更新时间： 2024-11-29 09:52:43
品牌 Logo 应用领域
德州仪器 - TI /
页数 文件大小 规格书
18页 355K
描述
STANDARD HIGH-SPEED PAL CIRCUITS

阅读下载

中文翻译

获取价格

PAL16R6A-2MJB 数据手册

 浏览型号PAL16R6A-2MJB的Datasheet PDF文件第2页浏览型号PAL16R6A-2MJB的Datasheet PDF文件第3页浏览型号PAL16R6A-2MJB的Datasheet PDF文件第4页浏览型号PAL16R6A-2MJB的Datasheet PDF文件第5页浏览型号PAL16R6A-2MJB的Datasheet PDF文件第6页浏览型号PAL16R6A-2MJB的Datasheet PDF文件第7页 
PAL16L8AM, PAL16L8A-2M, PAL16R4AM, PAL16R4A-2M  
PAL16R6AM, PAL16R6A-2M, PAL16R8AM, PAL16R8A-2M  
STANDARD HIGH-SPEED PAL CIRCUITS  
SRPS016 – D2705, FEBRUARY 1984 – REVISED MARCH 1992  
PAL16L8’  
J OR W PACKAGE  
•
Choice of Operating Speeds  
High-Speed, A Devices . . . 25 MHz Min  
Half-Power, A-2 Devices . . . 16 MHz Min  
(TOP VIEW)  
•
•
Choice of Input/Output Configuration  
I
I
I
I
I
I
I
I
I
V
1
2
3
4
5
6
7
8
9
10  
20  
19  
18  
CC  
Package Options Include Both Ceramic DIP  
and Chip Carrier in Addition to Ceramic  
Flat Package  
O
I/O  
17 I/O  
16 I/O  
15 I/O  
14 I/O  
13 I/O  
I/O  
PORT  
S
I
3-STATE  
REGISTERED  
Q OUTPUTS  
DEVICE  
INPUTS O OUTPUTS  
PAL16L8  
PAL16R4  
PAL16R6  
PAL16R8  
10  
8
2
0
0
0
0
6
4
2
0
4 (3-state buffers)  
6 (3-state buffers)  
8 (3-state buffers)  
12  
11  
O
I
8
GND  
8
description  
PAL16L8’  
FK PACKAGE  
These programmable array logic devices feature  
high speed and a choice of either standard or  
half-power devices. They combine Advanced  
Low-Power Schottky technology with proven  
titanium-tungsten fuses. These devices will  
provide reliable, high-performance substitutes for  
(TOP VIEW)  
3
2 1 20 19  
I/O  
I/O  
I/O  
I/O  
I/O  
I
I
I
I
I
conventional  
TTL  
logic.  
Their  
easy  
18  
17  
16  
15  
14  
4
5
6
7
8
programmabilityallowforquickdesignof”custom”  
functions and typically results in a more compact  
circuit board. In addition, chip carriers are  
available for further reduction in board space.  
9 10 11 12 13  
The Half-Power versions offer a choice of  
operating frequency, switching speeds, and  
power dissipation. In many cases, these  
Half-Power devices can result in significant power  
reduction from an overall system level.  
The PAL16’ M series is characterized for  
operation over the full military temperature range  
of –55°C to 125°C.  
PAL is a registered trademark of Advanced Micro Devices Inc.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
Copyright 1992, Texas Instruments Incorporated  
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1
1234567...18

中文翻译

下载PDF

PAL16R6A-2MJB 替代型号

型号 品牌 替代类型 描述 数据表
PAL16R6A-2MJ TI

完全替代

 STANDARD HIGH-SPEED PAL CIRCUITS

与PAL16R6A-2MJB相关器件

型号 品牌 获取价格 描述 数据表
PAL16R6A-2ML/883B ROCHESTER

获取价格

 		OT PLD, 50ns, TTL, CQCC20, CERAMIC, LCC-20
PAL16R6A-2MW TI

获取价格

 		STANDARD HIGH-SPEED PAL CIRCUITS
PAL16R6A-2MWB TI

获取价格

 		STANDARD HIGH-SPEED PAL CIRCUITS
PAL16R6A2NC TI

获取价格

 		OT PLD, 35ns, PDIP20, PLASTIC, DIP-20
PAL16R6A2NC/A+ ETC

获取价格

 		Fuse-Programmable PLD
PAL16R6A2NC/B+ ETC

获取价格

 		Fuse-Programmable PLD
PAL16R6A2VC TI

获取价格

 		OT PLD, 35ns, PQCC20, PLASTIC, LCC-20
PAL16R6A4CJ ETC

获取价格

 		Fuse-Programmable PLD
PAL16R6A4CN ETC

获取价格

 		Fuse-Programmable PLD
PAL16R6A4CNL ETC

获取价格

 		Fuse-Programmable PLD

与PAL16R6A-2MJB相关文章

您还可以找


热门产品
PCB打样/小批量
铝基板
BOM智能配单
PCBA制造
钣金
精密CNC
模具注塑
薄膜开关
精选活动
PCBA打样特惠
四六层板品质升级
铝基板品质升级
一体化电子制造
DFM下载
服务支持
企业认证
产品展示
工厂展示
工艺能力
积分商城
关于捷配
捷配简介
企业文化
公司动态
人才招聘
联系我们
帮助中心
下单流程
付款流程
开票流程
常见问题
全球PCB制造服务专线 400-613-0088

工作时间：9:00-21:00

CEO邮箱：ceo@jiepei.com

投诉邮箱：tousu@jiepei.com

捷配网-微信公众号 微信公众号
捷配网-微信公众号 抖音公众号
资质认证：
合作快递：
支付方式：
Copyright © 2024 Jiepei.com Inc. All Rights Reserved. 版权所有:杭州捷配信息科技有限公司 浙公网安备 33010502006866号 浙ICP备10014259号-119 营业执照ICP证