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PAL16L8J-MIL PDF预览

PAL16L8J-MIL

更新时间: 2024-11-03 13:12:11
品牌 Logo 应用领域
德州仪器 - TI /
页数 文件大小 规格书
18页 355K
描述
IC,SIMPLE-PLD,PAL-TYPE,TTL,DIP,20PIN,CERAMIC

PAL16L8J-MIL 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:DIP, DIP20,.3Reach Compliance Code:unknown
风险等级:5.92架构:PAL-TYPE
JESD-30 代码:R-XDIP-T20JESD-609代码:e0
输入次数:16输出次数:8
产品条款数:64端子数量:20
最高工作温度:125 °C最低工作温度:-55 °C
输出函数:COMBINATORIAL封装主体材料:CERAMIC
封装代码:DIP封装等效代码:DIP20,.3
封装形状:RECTANGULAR封装形式:IN-LINE
电源:5 V可编程逻辑类型:OT PLD
传播延迟:45 ns认证状态:Not Qualified
筛选级别:MIL-STD-883 Class B (Modified)子类别:Programmable Logic Devices
标称供电电压:5 V表面贴装:NO
技术:TTL温度等级:MILITARY
端子面层:Tin/Lead (Sn/Pb)端子形式:THROUGH-HOLE
端子节距:2.54 mm端子位置:DUAL
Base Number Matches:1

PAL16L8J-MIL 数据手册

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PAL16L8AM, PAL16L8A-2M, PAL16R4AM, PAL16R4A-2M  
PAL16R6AM, PAL16R6A-2M, PAL16R8AM, PAL16R8A-2M  
STANDARD HIGH-SPEED PAL CIRCUITS  
SRPS016 – D2705, FEBRUARY 1984 – REVISED MARCH 1992  
PAL16L8’  
J OR W PACKAGE  
Choice of Operating Speeds  
High-Speed, A Devices . . . 25 MHz Min  
Half-Power, A-2 Devices . . . 16 MHz Min  
(TOP VIEW)  
Choice of Input/Output Configuration  
I
I
I
I
I
I
I
I
I
V
1
2
3
4
5
6
7
8
9
10  
20  
19  
18  
CC  
Package Options Include Both Ceramic DIP  
and Chip Carrier in Addition to Ceramic  
Flat Package  
O
I/O  
17 I/O  
16 I/O  
15 I/O  
14 I/O  
13 I/O  
I/O  
PORT  
S
I
3-STATE  
REGISTERED  
Q OUTPUTS  
DEVICE  
INPUTS O OUTPUTS  
PAL16L8  
PAL16R4  
PAL16R6  
PAL16R8  
10  
8
2
0
0
0
0
6
4
2
0
4 (3-state buffers)  
6 (3-state buffers)  
8 (3-state buffers)  
12  
11  
O
I
8
GND  
8
description  
PAL16L8’  
FK PACKAGE  
These programmable array logic devices feature  
high speed and a choice of either standard or  
half-power devices. They combine Advanced  
Low-Power Schottky technology with proven  
titanium-tungsten fuses. These devices will  
provide reliable, high-performance substitutes for  
(TOP VIEW)  
3
2 1 20 19  
I/O  
I/O  
I/O  
I/O  
I/O  
I
I
I
I
I
conventional  
TTL  
logic.  
Their  
easy  
18  
17  
16  
15  
14  
4
5
6
7
8
programmabilityallowforquickdesignofcustom”  
functions and typically results in a more compact  
circuit board. In addition, chip carriers are  
available for further reduction in board space.  
9 10 11 12 13  
The Half-Power versions offer a choice of  
operating frequency, switching speeds, and  
power dissipation. In many cases, these  
Half-Power devices can result in significant power  
reduction from an overall system level.  
The PAL16’ M series is characterized for  
operation over the full military temperature range  
of –55°C to 125°C.  
PAL is a registered trademark of Advanced Micro Devices Inc.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
Copyright 1992, Texas Instruments Incorporated  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
1

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