SMT Power Inductor
High Current Molded Power Inductor - PA4343.XXXANLT Series
Height: 6.5mm Max
Footprint: 14.0mm x 12.8mm Max
Current Rating: up to 42.0A
Inductance Range: 0.22uH to 68.0uH
Shielded construction and compact design
High current, low DCR, and high efficiency
Minimized acoustic noise and minimized leakage flux
Electrical Specifications @ 25°C - Operating Temperature -55°C to +155°C
DC
Saturation
Current
Max.
Inductance
100KHz, 1V
Rated
Current
Resistance
Part
Number
Mechanical
MAX.
T Y P.
uH±20%
A
mΩ
mΩ
A
PA4343.221ANLT
PA4343.681ANLT
PA4343.102ANLT
PA4343.152ANLT
PA4343.222ANLT
PA4343.332ANLT
PA4343.472ANLT
PA4343.562ANLT
PA4343.682ANLT
PA4343.822ANLT
PA4343.103ANLT
PA4343.223ANLT
PA4343.333ANLT
PA4343.683ANLT
0.22
0.68
1.00
1.50
2.20
3.30
4.70
5.60
6.80
8.20
10.0
22.0
33.0
68.0
42.0
33.0
29.0
25.0
21.0
19.0
17.0
15.0
14.0
12.5
11.0
8.0
0.46
1.5
0.4
1.25
1.5
105
46.0
36.0
30.0
24.0
22.5
21.0
19.5
18.0
17.0
15.0
9.0
Footprint 1
Footprint 1
Footprint 1
Footprint 1
Footprint 2
Footprint 2
Footprint 2
Footprint 2
Footprint 2
Footprint 2
Footprint 2
Footprint 2
Footprint 2
Footprint 2
1.8
2.53
4.2
2.2
3.7
6.2
5.3
8.0
6.8
9.8
8.3
11.3
13.8
15.8
35.0
55.0
100
9.8
12.0
13.0
31.0
46.0
82.0
6.5
8.0
4.8
5.0
Notes:
1. Actual temperature of the component during system operation (ambient plus tempera- 3. The rated current is the DC current required to raise the component temperature by
ture rise) must be within the standard operating range. approximately 40�C. Take note that the components’ performanc varies depending on the
2. The saturation current is the current at which the initial inductance drops approximately system condition. It is suggested that the component be tested at the system level, to
30% at the stated ambient temperature. This current is determined by placing the com- verify the temperature rise of the component during system operation.
ponent in the specified ambient environment and applying a short duration pulse cur- 4. The part temperature (ambient+temp rise) should not exceed 155�C under worst case
rent (to eliminate self-heating effect) to the component.
operating conditions. Circuit design, PCB trace size and thickness, airflow and other cool-
ing provisions all affect the part temperature. Part temperature should be verified in the
end application.
http://www.power.pulseelectronics.com/contact
power.pulseelectronics.com
P793.C (09/17)
1