Datasheet > P6SMB300A

P6SMB300A

更新时间： 2024-11-30 09:54:39

品牌	Logo	应用领域
强茂 - PANJIT		二极管光电二极管局域网
页数	文件大小	规格书
5页	140K
描述
SURFACE MOUNT TRANSIENT VOLTAGE SUPPRESSOR POWER

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数据手册

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P6SMB300A 数据手册

P6SMB SERIES

SURFACE MOUNT TRANSIENT VOLTAGE SUPPRESSOR POWER 600 Watts

6.8 to 550 Volts

BREAK DOWN VOLTAGE

FEATURES

• For surface mounted applications in order to optimize board space.

• Low profile package

• Built-in strain relief

• Glass passivated junction

• Low inductance

• Typical I_Dless than 1.0µA above 10V

• Plastic package has Underwriters Laboratory

Fammability Classification 94V-O

• High temperature soldering : 260°C /10 seconds at terminals

• In compliance with EU RoHS 2002/95/EC directives

MECHANICAL DATA

• Case:JEDEC DO-214AA ,Molded plastic over passivated junction

• Terminals: Solder plated,solderable per MIL-STD-750,Method 2026

• Polarity: Color band denotes positive end (cathode)

• Standard Packaging:12mm tape (EIA-481)

• Weight: 0.003 ounce, 0.093 gram

DEVICES FOR BIPOLAR APPLICATIONS

For Bidirectional use C or CA Suffix for types

Electrical characteristics apply in both directions.

MAXIMUM RATINGS AND CHARACTERISTICS

Rating at 25°Cambient temperature unless otherwise specified. Resistive or inductive load, 60Hz.

For Capacitive load derate current by 20%.

Rating

Symbol

Value

600

Units

Peak Pulse Power Dissipation on 10/1000uS waveform (Notes 1,2, Fig.1)

P_{P P M}

Watts

Peak Forward Surge Current 8.3ms single half sine-wave

superimposed on rated load (JEDEC Method) (Notes 2,3)

I_{FS M}

100

see Table 1

Amps

^OC / W

^OC

Peak Pulse Current on 10/1000us waveform(Note 1)Fig.3

Typical Thermal Resistance Junction to Air (Notes 2)

Operating Junction and Storage Temperature Range

I_{P P M}

R_θJA

T_J,T_{S TG}

-55 to +150

NOTES:

1. Non-repetitive current pulse, per Fig.3 and derated above T = 25 C per Fig. 2.

2. Mounted on 5.0mm (0.13mm thick) land areas.

3. Measured on 8.3ms, single half sine-wave or equivalent square wave, duty cycle = 4 pulses per minute maximum.

STAD-APR.21.2009

PAGE . 1

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