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P4C1682-20FSMB PDF预览

P4C1682-20FSMB

更新时间: 2024-11-27 10:38:39
品牌 Logo 应用领域
PYRAMID 静态存储器光电二极管内存集成电路
页数 文件大小 规格书
10页 121K
描述
Standard SRAM, 4KX4, 20ns, CMOS, PDFP24, DFP-24

P4C1682-20FSMB 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Active零件包装代码:DFP
包装说明:DFP,针数:24
Reach Compliance Code:compliantECCN代码:3A001.A.2.C
HTS代码:8542.32.00.41风险等级:5.42
最长访问时间:20 nsJESD-30 代码:R-PDFP-F24
内存密度:16384 bit内存集成电路类型:STANDARD SRAM
内存宽度:4功能数量:1
端子数量:24字数:4096 words
字数代码:4000工作模式:ASYNCHRONOUS
最高工作温度:125 °C最低工作温度:-55 °C
组织:4KX4封装主体材料:PLASTIC/EPOXY
封装代码:DFP封装形状:RECTANGULAR
封装形式:FLATPACK并行/串行:PARALLEL
峰值回流温度(摄氏度):NOT SPECIFIED认证状态:Not Qualified
筛选级别:MIL-STD-883 Class B座面最大高度:2.921 mm
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS温度等级:MILITARY
端子形式:FLAT端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:9.779 mmBase Number Matches:1

P4C1682-20FSMB 数据手册

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P4C1681, P4C1682  
ULTRA HIGH SPEED 4K x 4  
STATIC CMOS RAMS  
FEATURES  
Fully TTL Compatible Inputs and Outputs  
Full CMOS, 6T Cell  
StandardPinout(JEDECApproved)  
– 24-Pin 300 mil DIP  
– 24-Pin 300 mil SOIC  
– 24-Pin 300 mil SOJ  
– 24-Pin Solder Seal Flat Pack  
– 28-Pin LCC (450 mil x 450 mil)  
High Speed (Equal Access and Cycle Times)  
– 12/15/20/25 ns (Commercial)  
20/25/35ns(Military)  
Low Power Operation  
Single 5V ± 10%Power Supply  
Separate Inputs and Outputs  
– P4C1681 Input Data at Outputs during Write  
– P4C1682 Outputs in High Z during Write  
DESCRIPTION  
Access times as fast as 12 nanoseconds are available,  
permitting greatly enhanced system operating speeds.  
The P4C1681 and P4C1682are16,384-bit(4Kx4)ultra  
high speed static RAMs similar to theP4C168,but with  
separate data I/O pins. The P4C1681 features a  
transparent write operation; the outputs of the P4C1682  
are in high impedance during the write cycle. All devices  
have low power standby modes. The RAMs operate  
from a single 5V ± 10% tolerance power supply.  
.
CMOS is used to reduce power consumption.  
TheP4C1681andP4C1682areavailablein24-pin300mil  
DIP, SOIC, SolderSealFlatpack, andSOJpackages, as  
well as a 28-pin LCC package, providing excellent board  
leveldensities.  
FUNCTIONALBLOCKDIAGRAM  
PINCONFIGURATIONS  
LCC (L5-1)  
DIP (P4,C4), SOIC (S4), SOJ (J4)  
SOLDER SEAL FLAT PACK (FS-1)  
Do c um e nt # SRAM109 REV B  
Re vise d No ve m b e r 2005  
1

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