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P4C168-15FC PDF预览

P4C168-15FC

更新时间: 2024-09-29 04:10:31
品牌 Logo 应用领域
PYRAMID /
页数 文件大小 规格书
15页 234K
描述
ULTRA HIGH SPEED 4K x 4 STATIC CMOS RAMS

P4C168-15FC 数据手册

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P4C168, P4C169, P4C170  
ULTRA HIGH SPEED 4K x 4  
STATIC CMOS RAMS  
FEATURES  
Full CMOS, 6T Cell  
Fully TTL Compatible, Common I/O Ports  
Three Options  
High Speed (Equal Access and Cycle Times)  
– 12/15/20/25/35ns (Commercial)  
– P4C168 Low Power Standby Mode  
– P4C169 Fast Chip Select Control  
– P4C170 Fast Chip Select, Output Enable  
Controls  
– 20/25/35/45/55/70ns (P4C168 Military)  
Low Power Operation (Commercial)  
– 715 mW Active  
Standard Pinout (JEDEC Approved)  
– 193 mW Standby (TTL Input) P4C168  
– 83 mW Standby (CMOS Input) P4C168  
– P4C168: 20-pin DIP, SOJ, LCC, SOIC,  
CERPACK, and Flat Pack  
Single 5V±10% Power Supply  
– P4C169: 20-pin DIP and SOIC  
– P4C170: 22-pin DIP  
DESCRIPTION  
Access times as fast as 12 nanoseconds are available,  
permitting greatly enhanced system operating speeds.  
CMOSisusedtoreducepowerconsumptiontoalow715  
mW active, 193 mW standby.  
The P4C168, P4C169 and P4C170 are a family of  
16,384-bitultrahigh-speedstaticRAMsorganizedas4K  
x4. Allthreedeviceshavecommoninput/outputports.The  
P4C168 enters the standby mode when the chip enable  
(CE) control goes HIGH; with CMOS input levels, power  
consumptionisonly83mWinthismode.BoththeP4C169  
and the P4C170 offer a fast chip select access time that  
is only 67% of the address access time. In addition, the  
P4C170 includes an output enable (OE) control to elimi-  
nate data bus contention. The RAMs operate from a  
single 5V ± 10% tolerance power supply.  
TheP4C168andP4C169areavailablein20-pin(P4C170  
in 22-pin) 300 mil DIP packages providing excellent  
boardleveldensities. TheP4C168isalsoavailablein20-  
pin 300 mil SOIC, SOJ, CERPACK, and Flat Pack  
packages.  
The P4C169 is also available in a 20-pin 300 mil SOIC  
package.  
PIN CONFIGURATIONS  
FUNCTIONAL BLOCK DIAGRAM  
P4C170  
P4C168  
P4C169  
DIP (P2)  
SOIC (S2)  
DIP (P3)  
DIP (P2, C6, D2)  
SOIC (S2)  
SOJ (J2)  
CERPACK (F2)  
SOLDER SEAL FLAT PACK (FS-2)  
Document # SRAM107 REV A  
Revised October 2005  
1

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