P4C1256
HIGH SPEED 32K x 8
STATIC CMOS RAM
FEATURES
High Speed (Equal Access and Cycle Times)
– 12/15/20/25/35 ns (Commercial)
– 15/20/25/35/45 ns (Industrial)
– 20/25/35/45/55/70 ns (Military)
Low Power
Single 5V±10% Power Supply
Easy Memory Expansion Using CE and OE Inputs
Common Data I/O
Fast tOE
Automatic Power Down
Packages
– 28-Pin 300 mil DIP, SOJ, TSOP
– 28-Pin 300 mil Ceramic DIP
– 28-Pin 600 mil Plastic and Ceramic DIP
– 28-Pin CERPACK
– 28-Pin Solder Seal Flat Pack
– 28-Pin SOP
Three-State Outputs
Fully TTL Compatible Inputs and Outputs
ꢀ Advanced CMOS Technology
– 28-Pin LCC (350 mil x 550 mil)
– 32-Pin LCC (450 mil x 550 mil)
DESCRIPTIOꢀ
The P4C1256 is a 262,144-bit high-speed CMOS static
RAM organized as 32K x 8. The CMOS memory requires
no clocks or refreshing, and has equal access and cycle
times. InputsarefullyTTL-compatible. TheRAMoperates
from a single 5V±10% tolerance power supply.
with matching access and cycle times. Memory locations
are specified on address pinsA0 toA14. Reading is accom-
plished by device selection (CE) and output enabling (OE)
while write enable (WE) remains HIGH. By presenting the
address under these conditions, the data in the addressed
memorylocationispresentedonthedatainput/outputpins.
The input/output pins stay in the HIGH Z state when either
CE or OE is HIGH or WE is LOW.
Access times as fast as 12 nanoseconds permit greatly
enhanced system operating speeds. CMOS is utilized to
reduce power consumption to a low level. The P4C1256
is a member of a family of PACE RAM™ products offering
fast access times.
PackageoptionsfortheP4C1256include28-pinDIP,SOJ,
and TSOP packages. For military temperature range,
Ceramic DIP and LCC packages are available.
The P4C1256 devices provides asynchronous operation
FUꢀCTIOꢀAL BLOCK DIAꢁRAM
PIꢀ COꢀFIꢁURATIOꢀS
DIP (P5, P6, C5, C5-1, D5-1, D5-2), SOJ (J5), SOP (S11-1, S11-3)
CERPACK (F4, FS-5) SIMILAR
LCC and TSOP configurations at end of datasheet
Document # SRAM119 REV I
Revised July 2010