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OPA656TDB2 PDF预览

OPA656TDB2

更新时间: 2024-10-27 11:46:07
品牌 Logo 应用领域
德州仪器 - TI 运算放大器放大器电路输入元件
页数 文件大小 规格书
4页 74K
描述
WIDEBAND, UNITY-GAIN STABLE, FET-INPUT OPERATIONAL AMPLIFIER

OPA656TDB2 技术参数

生命周期:Active零件包装代码:DIE
包装说明:DIE-7针数:7
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8542.33.00.01Factory Lead Time:6 weeks
风险等级:5.79Is Samacsys:N
放大器类型:OPERATIONAL AMPLIFIER架构:VOLTAGE-FEEDBACK
最大平均偏置电流 (IIB):0.000005 µA25C 时的最大偏置电流 (IIB):0.00002 µA
最小共模抑制比:88 dB标称共模抑制比:95 dB
频率补偿:YES最大输入失调电流 (IIO):0.00001 µA
最大输入失调电压:600 µVJESD-30 代码:R-XUUC-N7
长度:0.988 mm低-偏置:YES
低-失调:NO微功率:NO
功能数量:1端子数量:7
封装主体材料:UNSPECIFIED封装代码:DIE
封装形状:RECTANGULAR封装形式:UNCASED CHIP
峰值回流温度(摄氏度):NOT SPECIFIED功率:NO
可编程功率:NO标称压摆率:290 V/us
子类别:Operational Amplifier最大压摆率:16 mA
表面贴装:YES端子形式:NO LEAD
端子位置:UPPER处于峰值回流温度下的最长时间:NOT SPECIFIED
标称均一增益带宽:230000 kHz最小电压增益:1000
宽带:YES宽度:0.866 mm
Base Number Matches:1

OPA656TDB2 数据手册

 浏览型号OPA656TDB2的Datasheet PDF文件第2页浏览型号OPA656TDB2的Datasheet PDF文件第3页浏览型号OPA656TDB2的Datasheet PDF文件第4页 
OPA656-DIE  
www.ti.com  
SBOS596 MARCH 2012  
WIDEBAND, UNITY-GAIN STABLE, FET-INPUT OPERATIONAL AMPLIFIER  
Check for Samples: OPA656-DIE  
1
FEATURES  
Unity-Gain Bandwidth  
Low Input Bias Current  
Low Offset and Drift  
Low DL  
APPLICATIONS  
Wideband Photodiode Amplifiers  
Sample-and-Hold Buffers  
CCD Output Buffers  
High Output Current  
Low Input Voltage Noise  
ADC Input Buffers  
Wideband Precision Amplifiers  
Test and Measurement Front Ends  
DESCRIPTION  
The OPA656 combines a very wideband, unity-gain stable, voltage-feedback op amp with a FET-input stage to  
offer an ultra high dynamic-range amplifier for ADC (analog-to-digital converter) buffering and transimpedance  
applications. Extremely low DC errors give good precision in optical applications.  
The high unity-gain stable bandwidth and JFET input allows exceptional performance in high-speed, low-noise  
integrators.  
ORDERING INFORMATION(1)  
PACKAGE  
DESIGNATOR  
PRODUCT  
PACKAGE(2)  
ORDERABLE PART NUMBER  
PACKAGE QUANTITY  
OPA656TDB1  
OPA656TDB2  
400  
10  
OPA656  
TD  
Bare die in waffle pack  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
web site at www.ti.com.  
(2) Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality  
Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room  
temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not  
warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2012, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

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