MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOT−23 5−LEAD
CASE 1212−01
ISSUE A
DATE 28 JAN 2011
SCALE 2:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSIONS: MILLIMETERS.
3. DATUM C IS THE SEATING PLANE.
A
A2
B
A
D
S
A1
0.05
MILLIMETERS
5
1
4
DIM MIN
MAX
1.45
0.10
1.30
0.50
0.25
3.10
3.10
1.80
E
L
A
A1
A2
b
---
0.00
1.00
0.30
0.10
2.70
2.50
1.50
2
3
E1
5X b
L1
C
c
M
S
S
A
D
0.10
C B
e
C
E
E1
e
0.95 BSC
L
0.20
0.45
---
L1
0.75
RECOMMENDED
SOLDERING FOOTPRINT*
GENERIC
MARKING DIAGRAM*
XXX MG
5X
0.85
3.30
G
XXX = Specific Device Code
M
= Date Code
5X
G
= Pb−Free Package
(Note: Microdot may be in either location)
0.56
0.95
PITCH
DIMENSIONS: MILLIMETERS
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
98ASH70518A
DOCUMENT NUMBER:
STATUS:
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
1
October, 2002 − Rev. 0
DESCRIPTION: SOT−23 5−LEAD
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