是否无铅: | 含铅 | 是否Rohs认证: | 符合 |
生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | BGA, BGA256,16X16,40 | 针数: | 256 |
Reach Compliance Code: | compliant | ECCN代码: | 3A001.A.3 |
HTS代码: | 8542.31.00.01 | 风险等级: | 8.42 |
其他特性: | IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY | 地址总线宽度: | 13 |
桶式移位器: | NO | 边界扫描: | YES |
最大时钟频率: | 375 MHz | 外部数据总线宽度: | 16 |
格式: | FLOATING POINT | 内部总线架构: | MULTIPLE |
JESD-30 代码: | S-PBGA-B256 | JESD-609代码: | e1 |
长度: | 17 mm | 低功率模式: | YES |
湿度敏感等级: | 3 | 端子数量: | 256 |
最高工作温度: | 90 °C | 最低工作温度: | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | BGA |
封装等效代码: | BGA256,16X16,40 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY | 峰值回流温度(摄氏度): | 260 |
电源: | 1.2,1.8/3.3 V | 认证状态: | Not Qualified |
座面最大高度: | 2.05 mm | 子类别: | Other Microprocessor ICs |
最大供电电压: | 1.32 V | 最小供电电压: | 1.14 V |
标称供电电压: | 1.2 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | OTHER |
端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) | 端子形式: | BALL |
端子节距: | 1 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 17 mm |
uPs/uCs/外围集成电路类型: | DIGITAL SIGNAL PROCESSOR, OTHER | Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
OMAPL137DZKB3 | TI |
完全替代 |
OMAP-L137 Low-Power Applications Processor |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
OMAPL137BZKB4 | TI |
获取价格 |
OMAP-L137 Low-Power Applications Processor | |
OMAPL137BZKBA3 | TI |
获取价格 |
OMAP-L137 Low-Power Applications Processor | |
OMAPL137BZKBD4 | TI |
获取价格 |
OMAP-L137 Low-Power Applications Processor | |
OMAPL137BZKBT3 | TI |
获取价格 |
OMAP-L137 Low-Power Applications Processor | |
OMAPL137DZKB3 | TI |
获取价格 |
OMAP-L137 Low-Power Applications Processor | |
OMAPL137DZKB4 | TI |
获取价格 |
OMAP-L137 Low-Power Applications Processor | |
OMAPL137DZKBA3 | TI |
获取价格 |
OMAP-L137 Low-Power Applications Processor | |
OMAPL137DZKBD4 | TI |
获取价格 |
OMAP-L137 Low-Power Applications Processor | |
OMAPL137DZKBT3 | TI |
获取价格 |
OMAP-L137 Low-Power Applications Processor | |
OMAPL137-HT | TI |
获取价格 |
Multimedia Device Engineering Sample ES1.0 ES1.1 Version A |