Datasheet > NXB0102UN

NXB0102UN

更新时间： 2024-11-10 11:11:31

品牌	Logo	应用领域
安世 - NEXPERIA		/
页数	文件大小	规格书
24页	334K
描述
Dual supply translating transceiver; auto direction sensing; 3-stateProduction

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NXB0102UN 数据手册

NXB0102

Dual supply translating transceiver; auto direction sensing;

3-state

Rev. 5 — 6 September 2021

Product data sheet

1. General description

The NXB0102 is a 2-bit, dual supply translating transceiver with auto direction sensing, that

enables bidirectional voltage level translation. It features two 2-bit input-output ports (An and Bn),

one output enable input (OE) and two supply pins (V_CC(A)and V_CC(B)). V_CC(A)can be supplied at

any voltage between 1.2 V and 3.6 V and V_CC(B)can be supplied at any voltage between 1.65 V

and 5.5 V, making the device suitable for translating between any of the low voltage nodes (1.2 V,

1.5 V, 1.8 V, 2.5 V, 3.3 V and 5.0 V). Pins An and OE are referenced to V_CC(A)and pins Bn are

referenced to V_CC(B). A LOW level at pin OE causes the outputs to assume a high-impedance

OFF-state. This device is fully specified for partial power-down applications using I_OFF. The I_OFF

circuitry disables the output, preventing the damaging backflow current through the device when it

is powered down.

2. Features and benefits

•

Wide supply voltage range:

V_CC(A): 1.2 V to 3.6 V and V_CC(B): 1.65 V to 5.5 V

•

I_OFFcircuitry provides partial Power-down mode operation

Inputs accept voltages up to 5.5 V

ESD protection:

•

HBM: ANSI/ESDA/Jedec JS-001 Class 2 exceeds 2.5 kV for A port

HBM: ANSI/ESDA/Jedec JS-001 Class 3B exceeds 15 kV for B port

CDM: ANSI/ESDA/Jedec JS-002 Class C3 exceeds 1.5 kV

•

Latch-up performance exceeds 100 mA per JESD 78B Class II

Specified from −40 °C to +85 °C and −40 °C to +125 °C

3. Ordering information

Table 1. Ordering information

Type number

Package

Temperature range Name

Description

Version

NXB0102DC

NXB0102GT

NXB0102UN

-40 °C to +125 °C

VSSOP8

plastic very thin shrink small outline package;

8 leads; body width 2.3 mm

SOT765-1

XSON8

plastic extremely thin small outline package;

no leads; 8 terminals; body 1 × 1.95 × 0.5 mm

SOT833-1

WLCSP8

wafer level chip-scale package; 8 bumps;

0.75 × 1.55 × 0.60 mm

SOT8023-1

12 3 4 5 6 7...24

中文翻译

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