DATA SHEET
www.onsemi.com
MOSFET - Power, Dual
N-Channel
40 V, 7.6 mW, 51 A
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
7.6 mꢂ @ 10 V
40 V
51 A
12.6 mꢂ @ 4.5 V
NVMJD7D4N04CL
Features
• Small Footprint (5x6 mm) for Compact Design
Dual N−Channel
D1
D2
• Low R
to Minimize Conduction Losses
• Low Q and Capacitance to Minimize Driver Losses
DS(on)
G
G1
G2
• AEC−Q101 Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant
S1
S2
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Parameter
Drain−to−Source Voltage
Symbol
Value
40
Unit
V
MARKING
DIAGRAM
D1 D1 D2 D2
V
DSS
Gate−to−Source Voltage
V
GS
20
V
Continuous Drain
Current R
T
= 25°C
= 100°C
= 25°C
I
51
A
C
D
7D4N04
CL
AWLYW
ꢀ
JC
T
C
36
(Notes 1, 2, 3)
Steady
State
LFPAK8
CASE 760AF
Power Dissipation
T
C
P
37.5
19
W
A
D
R
(Notes 1, 2)
ꢀ
JC
T
C
= 100°C
1
S1 G1 S2 G2
Continuous Drain
Current R
T = 25°C
A
I
D
15
7D4N04CL = Specific Device Code
ꢀ
JA
T = 100°C
A
11
(Notes 1, 2, 3)
A
WL
Y
= Assembly Location
= Wafer Lot
Steady
State
Power Dissipation
T = 25°C
A
P
3.2
1.6
197
W
D
= Year
R
(Notes 1, 2)
ꢀ
JA
T = 100°C
A
W
= Work Week
Pulsed Drain Current
T = 25°C, t = 10 ꢁ s
I
DM
A
A
p
Operating Junction and Storage Temperature
Range
T , T
−55 to
°C
J
stg
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.
+175
Source Current (Body Diode)
I
S
31.3
68
A
Single Pulse Drain−to−Source Avalanche
E
AS
mJ
Energy (T = 25°C, I
= 2.9 A)
J
L(pk)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
L
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol
Value
4
Unit
Junction−to−Case − Steady State
Junction−to−Ambient − Steady State (Note 2)
R
°C/W
ꢀ
JC
R
47.3
ꢀ
JA
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2
2. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
© Semiconductor Components Industries, LLC, 2020
1
Publication Order Number:
August, 2022 − Rev. 1
NVMJD7D4N04CL/D