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NVMJD7D4N04CLTWG PDF预览

NVMJD7D4N04CLTWG

更新时间: 2023-09-03 20:32:36
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 248K
描述
Dual N−Channel Power MOSFET 40V, 52A, 7.4mΩ

NVMJD7D4N04CLTWG 数据手册

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DATA SHEET  
www.onsemi.com  
MOSFET - Power, Dual  
N-Channel  
40 V, 7.6 mW, 51 A  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
7.6 m@ 10 V  
40 V  
51 A  
12.6 m@ 4.5 V  
NVMJD7D4N04CL  
Features  
Small Footprint (5x6 mm) for Compact Design  
Dual NChannel  
D1  
D2  
Low R  
to Minimize Conduction Losses  
Low Q and Capacitance to Minimize Driver Losses  
DS(on)  
G
G1  
G2  
AECQ101 Qualified and PPAP Capable  
These Devices are PbFree and are RoHS Compliant  
S1  
S2  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
40  
Unit  
V
MARKING  
DIAGRAM  
D1 D1 D2 D2  
V
DSS  
GatetoSource Voltage  
V
GS  
20  
V
Continuous Drain  
Current R  
T
= 25°C  
= 100°C  
= 25°C  
I
51  
A
C
D
7D4N04  
CL  
AWLYW  
JC  
T
C
36  
(Notes 1, 2, 3)  
Steady  
State  
LFPAK8  
CASE 760AF  
Power Dissipation  
T
C
P
37.5  
19  
W
A
D
R
(Notes 1, 2)  
JC  
T
C
= 100°C  
1
S1 G1 S2 G2  
Continuous Drain  
Current R  
T = 25°C  
A
I
D
15  
7D4N04CL = Specific Device Code  
JA  
T = 100°C  
A
11  
(Notes 1, 2, 3)  
A
WL  
Y
= Assembly Location  
= Wafer Lot  
Steady  
State  
Power Dissipation  
T = 25°C  
A
P
3.2  
1.6  
197  
W
D
= Year  
R
(Notes 1, 2)  
JA  
T = 100°C  
A
W
= Work Week  
Pulsed Drain Current  
T = 25°C, t = 10 s  
I
DM  
A
A
p
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
°C  
J
stg  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information in the  
package dimensions section on page 5 of this data sheet.  
+175  
Source Current (Body Diode)  
I
S
31.3  
68  
A
Single Pulse DraintoSource Avalanche  
E
AS  
mJ  
Energy (T = 25°C, I  
= 2.9 A)  
J
L(pk)  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
THERMAL RESISTANCE MAXIMUM RATINGS  
Parameter  
Symbol  
Value  
4
Unit  
JunctiontoCase Steady State  
JunctiontoAmbient Steady State (Note 2)  
R
°C/W  
JC  
R
47.3  
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2
2. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2020  
1
Publication Order Number:  
August, 2022 Rev. 1  
NVMJD7D4N04CL/D  
 

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