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NVMFWS3D5N08XT1G PDF预览

NVMFWS3D5N08XT1G

更新时间: 2024-04-09 18:58:55
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 157K
描述
Single N-Channel Power MOSFET 80V, 126 A,?3 mΩ

NVMFWS3D5N08XT1G 数据手册

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DATA SHEET  
www.onsemi.com  
MOSFET - Power, Single  
N-Channel, STD Gate,  
SO8FL  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
80 V  
3.5 mW @ 10 V  
119 A  
D (5)  
80 V, 3.5 mW, 119 A  
NVMFWS3D5N08X  
G (4)  
Features  
Low Q , Soft Recovery Body Diode  
RR  
S (1,2,3)  
Low R  
to Minimize Conduction Losses  
DS(on)  
NCHANNEL MOSFET  
Low Q and Capacitance to Minimize Driver Losses  
G
AECQ101 Qualified and PPAP Capable  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant  
Applications  
Synchronous Rectification (SR) in DCDC and ACDC  
Primary Switch in Isolated DCDC Converter  
Motor Drives  
DFNW5 (SO8FL)  
CASE 507BA  
Automotive 48 V System  
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
3D5N8W  
AYWZZ  
Parameter  
DraintoSource Voltage  
Symbol  
Value  
80  
Unit  
V
V
DSS  
3D5N8W = Specific Device Code  
GatetoSource Voltage  
DC  
V
20  
V
GS  
A
Y
= Assembly Location  
= Year  
Continuous Drain Current  
(Note 1)  
T
= 25°C  
= 100°C  
= 25°C  
= 25°C,  
I
119  
84  
A
C
D
W
ZZ  
= Work Week  
= Assembly Lot Code  
T
C
Power Dissipation (Note 1)  
Pulsed Drain Current  
T
C
P
107  
470  
470  
W
A
D
T
C
I
DM  
t = 100 ms  
p
ORDERING INFORMATION  
See detailed ordering, marking and shipping information on  
page 5 of this data sheet.  
Pulsed Source Current  
(Body Diode)  
I
A
SM  
Operating Junction and Storage Temperature  
Range  
T , T  
J
55 to  
+175  
°C  
STG  
Source Current (Body Diode)  
I
162  
97  
A
S
Single Pulse Avalanche Energy (Note 3)  
(I = 44 A)  
PK  
E
AS  
mJ  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
2
1. Surfacemounted on FR4 board using 1 in , 1 oz Cu pad.  
2. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
3. E of 97 mJ is based on started T = 25°C, I = 44 A, V = 64 V, V =  
AS  
J
AS  
DD  
GS  
10 V, 100% avalanche tested.  
© Semiconductor Components Industries, LLC, 2023  
1
Publication Order Number:  
December, 2023 Rev. 0  
NVMFWS3D5N08X/D  
 

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