NTJD4158C, NVJD4158C
Small Signal MOSFET
30 V/−20 V, +0.25/−0.88 A,
Complementary, SC−88
Features
• Leading 20 V Trench for Low R
• ESD Protected Gate
Performance
DS(on)
www.onsemi.com
• SC−88 Package for Small Footprint (2 x 2 mm)
V
R
Typ
I Max
D
(BR)DSS
DS(on)
• NV Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
1.0 W @ 4.5 V
1.5 W @ 2.5 V
N−Ch
30 V
0.25 A
215 mW @ −4.5 V
345 mW @ −2.5 V
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
P−Ch
−20 V
−0.88 A
Compliant
Applications
• DC−DC Conversion
SC−88 (SOT−363)
(6−Leads)
• Load/Power Management
• Load Switch
S
G
D
1
2
3
6
5
4
D
1
1
1
2
• Cell Phones, MP3s, Digital Cameras, PDAs
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
G
S
2
Parameter
Drain−to−Source Voltage
Symbol Value
Unit
V
V
N−Ch
P−Ch
N−Ch
P−Ch
30
−20
20
DSS
2
Gate−to−Source Voltage
V
V
A
GS
12
(Top View)
N−Channel
Continuous Drain
Current (Note 1)
I
D
T = 25°C
A
0.25
Steady
State
MARKING DIAGRAM &
PIN ASSIGNMENT
T = 85°C
A
0.18
−0.88
−0.63
0.27
D1 G2 S2
6
P−Channel
Continuous Drain
Current (Note 1)
T = 25°C
A
Steady
State
T = 85°C
A
1
XXX MG
Power Dissipation
(Note 1)
Steady
State
P
D
W
A
G
SC−88 (SOT−363)
CASE 419B
T = 25°C
A
1
STYLE 26
Pulsed Drain Cur-
rent
I
DM
N−Ch
P−Ch
0.5
S1 G1 D2
tp = 10 ms
−3.0
XXX
M
= Specific Device Code
= Date Code
= Pb−Free Package
Operating Junction and Storage Temperature
T , T
−55 to
150
°C
J
stg
G
Source Current (Body Diode)
I
S
A
N−Ch
P−Ch
0.25
−0.48
260
(Note: Microdot may be in either location)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
L
°C
ORDERING INFORMATION
See detailed ordering and shipping information in the package
THERMAL RESISTANCE RATINGS
Parameter
dimensions section on page 6 of this data sheet.
Symbol
Max
Unit
Junction−to−Ambient – Steady State (Note 1)
R
460
°C/W
q
JA
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Surface mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces).
© Semiconductor Components Industries, LLC, 2015
1
Publication Order Number:
Febuary, 2015 − Rev. 5
NTJD4158C/D