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NVJD4158C PDF预览

NVJD4158C

更新时间: 2024-11-20 01:16:15
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安森美 - ONSEMI /
页数 文件大小 规格书
7页 91K
描述
Small Signal MOSFET

NVJD4158C 数据手册

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NTJD4158C, NVJD4158C  
Small Signal MOSFET  
30 V/−20 V, +0.25/−0.88 A,  
Complementary, SC−88  
Features  
Leading 20 V Trench for Low R  
ESD Protected Gate  
Performance  
DS(on)  
www.onsemi.com  
SC−88 Package for Small Footprint (2 x 2 mm)  
V
R
Typ  
I Max  
D
(BR)DSS  
DS(on)  
NV Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements; AEC−Q101 Qualified and  
PPAP Capable  
1.0 W @ 4.5 V  
1.5 W @ 2.5 V  
N−Ch  
30 V  
0.25 A  
215 mW @ −4.5 V  
345 mW @ −2.5 V  
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
P−Ch  
−20 V  
−0.88 A  
Compliant  
Applications  
DC−DC Conversion  
SC−88 (SOT−363)  
(6−Leads)  
Load/Power Management  
Load Switch  
S
G
D
1
2
3
6
5
4
D
1
1
1
2
Cell Phones, MP3s, Digital Cameras, PDAs  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
G
S
2
Parameter  
Drain−to−Source Voltage  
Symbol Value  
Unit  
V
V
N−Ch  
P−Ch  
N−Ch  
P−Ch  
30  
−20  
20  
DSS  
2
Gate−to−Source Voltage  
V
V
A
GS  
12  
(Top View)  
N−Channel  
Continuous Drain  
Current (Note 1)  
I
D
T = 25°C  
A
0.25  
Steady  
State  
MARKING DIAGRAM &  
PIN ASSIGNMENT  
T = 85°C  
A
0.18  
−0.88  
−0.63  
0.27  
D1 G2 S2  
6
P−Channel  
Continuous Drain  
Current (Note 1)  
T = 25°C  
A
Steady  
State  
T = 85°C  
A
1
XXX MG  
Power Dissipation  
(Note 1)  
Steady  
State  
P
D
W
A
G
SC−88 (SOT−363)  
CASE 419B  
T = 25°C  
A
1
STYLE 26  
Pulsed Drain Cur-  
rent  
I
DM  
N−Ch  
P−Ch  
0.5  
S1 G1 D2  
tp = 10 ms  
−3.0  
XXX  
M
= Specific Device Code  
= Date Code  
= Pb−Free Package  
Operating Junction and Storage Temperature  
T , T  
−55 to  
150  
°C  
J
stg  
G
Source Current (Body Diode)  
I
S
A
N−Ch  
P−Ch  
0.25  
−0.48  
260  
(Note: Microdot may be in either location)  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
°C  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
THERMAL RESISTANCE RATINGS  
Parameter  
dimensions section on page 6 of this data sheet.  
Symbol  
Max  
Unit  
Junction−to−Ambient – Steady State (Note 1)  
R
460  
°C/W  
q
JA  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. Surface mounted on FR4 board using 1 in sq pad size  
(Cu area = 1.127 in sq [1 oz] including traces).  
© Semiconductor Components Industries, LLC, 2015  
1
Publication Order Number:  
Febuary, 2015 − Rev. 5  
NTJD4158C/D  
 

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