Datasheet > NVJD4152P

NVJD4152P

更新时间： 2024-11-20 01:16:15

品牌	Logo	应用领域
安森美 - ONSEMI		/
页数	文件大小	规格书
5页	75K
描述
Trench Small Signal MOSFET

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NVJD4152P 数据手册

NTJD4152P, NVJD4152P

Trench Small Signal

MOSFET

20 V, 0.88 A, Dual P−Channel,

ESD Protected SC−88

Features

• Leading Trench Technology for Low R

Performance

DS(ON)

www.onsemi.com

• Small Footprint Package (SC70−6 Equivalent)

• ESD Protected Gate

Typ

I Max

(BR)DSS

DS(on)

• NV Prefix for Automotive and Other Applications Requiring Unique

Site and Control Change Requirements; AEC−Q101 Qualified and

PPAP Capable

215 mW @ −4.5 V

345 mW @ −2.5 V

−20 V

−0.88 A

• These are Pb−Free Devices

Applications

600 mW @ −1.8 V

• Load/Power Management

• Charging Circuits

• Load Switching

• Cell Phones, Computing, Digital Cameras, MP3s and PDAs

MAXIMUM RATINGS (T = 25°C unless otherwise stated)

Parameter

Drain−to−Source Voltage

Symbol

Value

−20

Unit

DSS

Gate−to−Source Voltage

Continuous Drain

Current (Note 1)

Steady T = 25°C

−0.88

−0.63

0.272

0.141

−1.0

−0.72

0.35

0.181

3.0

State

Top View

T = 85°C

Power Dissipation

(Note 1)

Steady T = 25°C

MARKING DIAGRAM &

PIN ASSIGNMENT

State

T = 85°C

Continuous Drain

Current (Note 2)

t v 5 s T = 25°C

D1 G2 S2

T = 85°C

Power Dissipation

(Note 2)

t v 5 s T = 25°C

SC−88/SOT−363

CASE 419B

STYLE 26

XXX MG

T = 85°C

Pulsed Drain Current

t ≤ 10 ms

S1 G1 D2

Operating Junction and Storage Temperature

T ,

−55 to

150

°C

STG

XXX

= Device Code

= Date Code

= Pb−Free Package

Continuous Source Current (Body Diode)

−0.48

260

Lead Temperature for Soldering Purposes

(1/8” from case for 10 s)

°C

(Note: Microdot may be in either location)

THERMAL RESISTANCE RATINGS (Note 1)

Parameter

Symbol Max Unit

ORDERING INFORMATION

See detailed ordering and shipping information in the package

dimensions section on page 4 of this data sheet.

Junction−to−Ambient – Steady State

Junction−to−Ambient − t v 5 s

Junction−to−Lead – Steady State

460 °C/W

357

226

Stresses exceeding those listed in the Maximum Ratings table may damage the

device. If any of these limits are exceeded, device functionality should not be

assumed, damage may occur and reliability may be affected.

1. Surface mounted on FR4 board using 1 in sq pad size

(Cu area = 1.127 in sq [1 oz] including traces), steady state.

2. Surface mounted on FR4 board using 1 in sq pad size

(Cu area = 1.127 in sq [1 oz] including traces), t v 5 s.

Publication Order Number:

February, 2015 − Rev. 6

NTJD4152P/D

12 3 4 5

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