NUP4107UPMU
Product Preview
Low Capacitance ESD
Protection Array for High
Speed Data Line Protection
The NUP4107UPMU ESD protection array is designed to protect
high speed data lines from ESD. Ultra−low capacitance and high level
of ESD protection makes this device well suited for use in USB 2.0
applications.
http://onsemi.com
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5
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Features
• Low Capacitance (< 2 pF Typical Between I/O Lines and Ground)
• ESD Rating of Class 3B (Exceeding 8 kV) per Human Body model
and Class C (Exceeding 400 V) per Machine Model
• Protection for the Following IEC Standards:
IEC 61000−4−2 (12 kV Contact)
3
1
• UL Flammability Rating of 94 V−0
• This is a Pb−Free Device
MARKING
DIAGRAM
Typical Applications
• USB 2.0 Data Line and Power Line Protection
• MIDDI Ports
1
UDFN6 1.6x1.6
MU SUFFIX
CASE 517AP
6
XX MG
G
1
• SIM Ports
XX
M
G
= Specific Device Code
= Date Code
= Pb−Free Package
• Gigabit Ethernet
• Notebook Computers
(Note: Microdot may be in either location)
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Rating
Symbol
Value
−40 to +125
−55 to +150
260
Unit
°C
PIN CONNECTIONS
Operating Junction Temperature Range
Storage Temperature Range
T
J
6
5
4
T
stg
°C
I/O
V
I/O
NC
I/O
1
2
3
Lead Solder Temperature −
Maximum (10 Seconds)
T
L
°C
GND
BUS
I/O
Human Body Model (HBM)
Machine Model (MM)
IEC 61000−4−2 Contact (ESD)
ESD
16000
400
12000
V
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
ORDERING INFORMATION
†
Device
Package
Shipping
NUP4107UPMUTAG UDFN6 3000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
This document contains information on a product under development. ON Semiconductor
reserves the right to change or discontinue this product without notice.
© Semiconductor Components Industries, LLC, 2008
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Publication Order Number:
November, 2008 − Rev. P0
NUP4107UPMU/D