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NUP3115UPMU PDF预览

NUP3115UPMU

更新时间: 2024-11-19 06:00:43
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
4页 147K
描述
Transient Voltage Suppressors

NUP3115UPMU 数据手册

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NUP3115UPMU  
Transient Voltage  
Suppressors  
Low Capacitance ESD Protection for  
High Speed Data  
http://onsemi.com  
The threeline voltage transient suppressor array is designed to protect  
voltagesensitive components that require ultralow capacitance from  
ESD and transient voltage events. This device features a common anode  
D
1
D
2
D
3
V
CC  
design which protects three independent high speed data lines and a V  
CC  
power line in a single sixlead UDFN low profile package.  
Excellent clamping capability, low capacitance, low leakage, and fast  
response time make these parts ideal for ESD protection on designs  
where board space is at a premium. Because of its low capacitance, it is  
suited for use in high frequency designs such as a USB 2.0 high speed.  
6.8V  
16V  
Features  
Low Capacitance 0.8 pF  
UDFN Package, 1.6 x 1.6 mm  
Low Profile of 0.50 mm for Ultra Slim Design  
Stand Off Voltage: 5.5 V  
Low Leakage  
MARKING  
DIAGRAM  
1
UDFN6 1.6x1.6  
MU SUFFIX  
CASE 517AP  
6
P3 MG  
G
Protects up to Three Data Lines Plus a V Pin  
1
CC  
V Pin = 15 V Protection  
CC  
P3  
M
G
= Specific Device Code  
= Date Code  
= PbFree Package  
D , D , and D Pins = 6.4 V Minimum Protection  
1
2
3
IEC6100042: Level 4 ESD Protection  
This is a PbFree Device  
(Note: Microdot may be in either location)  
Typical Applications  
USB 2.0 HighSpeed Interface  
Cell Phones  
PIN CONNECTIONS  
6
5
4
V
CC  
D
1
D
2
D
3
1
2
3
MP3 Players  
GND  
NC  
NC  
SIM Card Protection  
MAXIMUM RATINGS (T = 25°C, unless otherwise specified)  
J
Symbol  
Rating  
Value  
Unit  
I
Peak Pulse Current  
V
Diode  
5.0  
A
PK  
CC  
ORDERING INFORMATION  
8x20 msec double exponential waveform  
Operating Junction Temperature Range  
Storage Temperature Range  
Device  
Package  
Shipping  
T
T
T
40 to 125  
55 to 150  
260  
°C  
°C  
°C  
J
NUP3115UPMUTAG UDFN6 3000/Tape & Reel  
STG  
L
(PbFree)  
Lead Solder Temperature – Maximum  
(10 seconds)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
ESD  
IEC 6100042 Contact  
8000  
V
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
See Application Note AND8308/D for further description of  
survivability specs.  
©
Semiconductor Components Industries, LLC, 2009  
1
Publication Order Number:  
September, 2009Rev. 1  
NUP3115UPMU/D  

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