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NUF2222FCT1G PDF预览

NUF2222FCT1G

更新时间: 2024-01-05 07:30:27
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 51K
描述
2 Line USB 1.1 Upstream EMI Filter

NUF2222FCT1G 技术参数

是否无铅: 不含铅生命周期:Contact Manufacturer
针数:8Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8504.50.80.00
Factory Lead Time:1 week风险等级:5.72
其他特性:CUT-OFF FREQUENCY 190 MHZ电容:36 µF
最大直流电阻:38 Ω滤波器类型:DATA LINE FILTER
高度:0.7 mmJESD-609代码:e3
长度:1.97 mm安装类型:SURFACE MOUNT
功能数量:2端子数量:8
最高工作温度:85 °C最低工作温度:-40 °C
包装材料:PLASTIC包装方法:TAPE AND REEL
物理尺寸:L1.97XB1.27XH0.7 (mm)子类别:Data Line Filters
端子面层:Matte Tin (Sn)宽度:1.27 mm
Base Number Matches:1

NUF2222FCT1G 数据手册

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NUF2222FC  
2 Line USB 1.1 Upstream  
EMI Filter  
This device is a 2 line EMI filter array for USB port protection in  
wireless applications. Greater than −20 dB attenuation is obtained at  
frequencies from 900 MHz to 3.0 GHz. It also has 2 lines for dedicated  
ESD protection. ESD protection is provided across all capacitors.  
http://onsemi.com  
Features  
A3  
C3  
EMI Filtering and ESD Protection  
Integration of 10 Discretes  
Provides Protection for IEC61000−4−2 (Level 4)  
15 kV (Contact)  
1.3 K  
A1  
B2  
33 R  
C1  
Flip−Chip Package  
D2  
Moisture Sensitivity Level 1  
(Gnd Pin)  
ESD Rating: Machine Model = C; Human Body Model = 3B  
33 R  
Benefits  
E1  
E3  
Reduces EMI/RFI Emissions on a Data Line  
Integrated Solution Offers Cost and Space Savings  
Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass  
Filter Response  
MARKING  
DIAGRAM  
1
Integrated Solution Improves System Reliability  
This is a Pb−Free Device  
1
Flip−Chip  
FC SUFFIX  
CASE 499AM  
2222AYWW  
Applications  
EMI Filtering and ESD Protection for Data Lines  
Cell Phones  
Handheld Products  
Notebook Computers  
MP3 Players  
2222  
A
Y
= Specific Device Code  
= Assembly Location  
= Year  
WW  
= Work Week  
PIN CONFIGURATION  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
A
Rating  
Contact Discharge  
Symbol  
Value  
Unit  
3
2 1  
ESD Discharge  
IEC61000−4−2  
V
15  
kV  
PP  
A
B
C
D
E
Operating Temperature Range  
Storage Temperature Range  
Junction Temperature  
T
OP  
−40 to +85  
−55 to +150  
+125  
°C  
°C  
°C  
T
STG  
T
J
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
ORDERING INFORMATION  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
Device  
NUF2222FCT1G  
Package  
Shipping†  
Flip−Chip 3000 Tape & Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2005  
1
Publication Order Number:  
June, 2005 − Rev. 0  
NUF2222FC/D  

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