Datasheet > NUF2222FC

NUF2222FC

更新时间： 2024-02-23 04:07:29

品牌	Logo	应用领域
安森美 - ONSEMI		/
页数	文件大小	规格书
6页	51K
描述
2 Line USB 1.1 Upstream EMI Filter

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中文翻译

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数据手册

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NUF2222FC 数据手册

NUF2222FC

2 Line USB 1.1 Upstream

EMI Filter

This device is a 2 line EMI filter array for USB port protection in

wireless applications. Greater than −20 dB attenuation is obtained at

frequencies from 900 MHz to 3.0 GHz. It also has 2 lines for dedicated

ESD protection. ESD protection is provided across all capacitors.

http://onsemi.com

Features

• EMI Filtering and ESD Protection

• Integration of 10 Discretes

• Provides Protection for IEC61000−4−2 (Level 4)

♦ 15 kV (Contact)

1.3 K

33 R

• Flip−Chip Package

• Moisture Sensitivity Level 1

(Gnd Pin)

• ESD Rating: Machine Model = C; Human Body Model = 3B

33 R

Benefits

• Reduces EMI/RFI Emissions on a Data Line

• Integrated Solution Offers Cost and Space Savings

• Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass

Filter Response

MARKING

DIAGRAM

• Integrated Solution Improves System Reliability

• This is a Pb−Free Device

Flip−Chip

FC SUFFIX

CASE 499AM

2222AYWW

Applications

• EMI Filtering and ESD Protection for Data Lines

• Cell Phones

• Handheld Products

• Notebook Computers

• MP3 Players

2222

= Specific Device Code

= Assembly Location

= Year

= Work Week

PIN CONFIGURATION

MAXIMUM RATINGS (T = 25°C unless otherwise noted)

Rating

Contact Discharge

Symbol

Value

Unit

2 1

ESD Discharge

IEC61000−4−2

Operating Temperature Range

Storage Temperature Range

Junction Temperature

−40 to +85

−55 to +150

+125

°C

STG

Maximum ratings are those values beyond which device damage can occur.

Maximum ratings applied to the device are individual stress limit values (not

normal operating conditions) and are not valid simultaneously. If these limits are

exceeded, device functional operation is not implied, damage may occur and

reliability may be affected.

ORDERING INFORMATION

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

Device

NUF2222FCT1G

Package

Shipping†

Flip−Chip 3000 Tape & Reel

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

Publication Order Number:

June, 2005 − Rev. 0

NUF2222FC/D

12 3 4 5 6

中文翻译

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与NUF2222FC相关器件

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NUF2441FC	ONSEMI	获取价格	Integrated Passive Filter with ESD Protection
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