Datasheet > NUF2221W1T2-REL-REPORT

NUF2221W1T2-REL-REPORT

更新时间： 2024-02-29 07:37:03

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NUF2221W1T2 Reliability Report

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Quality and Continuous

Improvement

Reliability Qualification Report

Device Qualification

Date: 10/16/2002

PCN:

Laura Rivers

Reliability Engineer

602 244 5474

Scott Savage

Reliability Manager

602 244 4848

1) Introduction:

Qualification of NUF2221W1T2 series of devices designed for applications requiring Line Termination, EMI Filtering and ESD

Protection.These are intented for use in upstream USB ports, Cellular phones, Wireless equipment and computer applications.

Offering an integrated solution, offering better ESD protection than available from a discete implemetation because of reduced

parasitic inductances, in a small package (SC88/SOT363) reducing PCB space and cost.

ESD Ratings: Jedec MM Class C, Jedec HBM 3B.

Compliant with IEC61000-4-2 (Level 4) 8KV (contact) 15KV (air)

2) Device Description:

Qual ID 1564

Wafer Fab Site ISMF

Assembly Site SBN

Seremban, Malaysia

Batam, Indonesia

Device NUF2221W1T2

ZLU22N

ZENER

SC88/SOT363

Line Source

Parent Tech

Technology

Package

AIT BATAM, IDN

Final Test Site

Reliability Lab

Max. Current

Die Size

SBN

Seremban, Malaysia

100mA

670 X 500

Max. Voltage

Flag Size

1.1mm X 0.625mm

Polarity

Related Qualification Report(s):

This series of devices is qualified by similarity based upon the NZMM7V04T4, rel report # 0450 , for die technology and the

NL27WZU04DFT2, rel report# 1242, for package technology.

completed.

Full characterization of the NUF2221W1T2 has also been

NUF2221W1T2_1564_2002.pdf

Product Reliability Engineering Services

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