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NTS2101P PDF预览

NTS2101P

更新时间: 2024-09-24 06:00:39
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
5页 62K
描述
Power MOSFET −8.0 V, −1.4 A, Single P−Channel, SC−70

NTS2101P 数据手册

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NTS2101P  
Power MOSFET  
−8.0 V, 1.4 A, Single P−Channel, SC−70  
Features  
Leading Trench Technology for Low R  
Extending Battery Life  
http://onsemi.com  
DS(on)  
−1.8 V Rated for Low Voltage Gate Drive  
V
R
DS(on)  
Typ  
I Max  
D
SC−70 Surface Mount for Small Footprint (2 x 2 mm)  
Pb−Free Package is Available  
(BR)DSS  
65 mW @ −4.5 V  
78 mW @ −2.5 V  
−8.0 V  
−1.4 A  
Applications  
117 mW @ −1.8 V  
High Side Load Switch  
Charging Circuit  
Single Cell Battery Applications such as Cell Phones,  
Digital Cameras, PDAs, etc.  
P−Channel MOSFET  
S
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
Parameter  
Drain−to−Source Voltage  
Symbol  
Value Units  
G
V
−8.0  
8.0  
V
V
A
DSS  
Gate−to−Source Voltage  
V
GS  
Continuous Drain  
Current (Note 1)  
Steady T = 25°C  
State  
I
−1.4  
−1.1  
−1.5  
0.29  
A
D
D
T = 70°C  
A
t 5 s T = 25°C  
A
A
MARKING DIAGRAM &  
PIN ASSIGNMENT  
Power Dissipation  
(Note 1)  
Steady T = 25°C  
State  
P
W
A
D
3
Drain  
3
t 5 s  
0.33  
−3.0  
W
A
Pulsed Drain Current  
tp = 10 ms  
I
DM  
1
TS M G  
2
G
Operating Junction and Storage Temperature  
T ,  
−55 to  
150  
°C  
J
SC−70/SOT−323  
CASE 419  
T
STG  
2
1
Source Current (Body Diode), Continuous  
I
−0.46  
260  
A
Gate Source  
S
STYLE 8  
Lead Temperature for Soldering Purposes  
T
°C  
L
(1/8from case for 10 s)  
TS  
M
G
= Device Code  
= Date Code*  
= Pb−Free Package  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Max  
430  
375  
Units  
(Note: Microdot may be in either location)  
Junction−to−Ambient – Steady State (Note 1)  
Junction−to−Ambient − t 5 s (Note 1)  
R
°C/W  
*Date Code orientation may vary depending  
upon manufacturing location.  
q
JA  
JA  
R
q
ORDERING INFORMATION  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
Device  
Package  
Shipping  
NTS2101PT1  
SOT−323  
3000/Tape & Reel  
1. Surface−mounted on FR4 board using 1 in sq pad size  
(Cu area = 1.127 in sq [1 oz] including traces).  
SOT−323  
(Pb−Free)  
NTS2101PT1G  
3000/Tape & Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
March, 2006 − Rev. 1  
NTS2101P/D  
 

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