NTS2101P
Power MOSFET
−8.0 V, −1.4 A, Single P−Channel, SC−70
Features
• Leading Trench Technology for Low R
Extending Battery Life
http://onsemi.com
DS(on)
• −1.8 V Rated for Low Voltage Gate Drive
V
R
DS(on)
Typ
I Max
D
• SC−70 Surface Mount for Small Footprint (2 x 2 mm)
• Pb−Free Package is Available
(BR)DSS
65 mW @ −4.5 V
78 mW @ −2.5 V
−8.0 V
−1.4 A
Applications
117 mW @ −1.8 V
• High Side Load Switch
• Charging Circuit
• Single Cell Battery Applications such as Cell Phones,
Digital Cameras, PDAs, etc.
P−Channel MOSFET
S
MAXIMUM RATINGS (T = 25°C unless otherwise stated)
J
Parameter
Drain−to−Source Voltage
Symbol
Value Units
G
V
−8.0
8.0
V
V
A
DSS
Gate−to−Source Voltage
V
GS
Continuous Drain
Current (Note 1)
Steady T = 25°C
State
I
−1.4
−1.1
−1.5
0.29
A
D
D
T = 70°C
A
t ≤ 5 s T = 25°C
A
A
MARKING DIAGRAM &
PIN ASSIGNMENT
Power Dissipation
(Note 1)
Steady T = 25°C
State
P
W
A
D
3
Drain
3
t ≤ 5 s
0.33
−3.0
W
A
Pulsed Drain Current
tp = 10 ms
I
DM
1
TS M G
2
G
Operating Junction and Storage Temperature
T ,
−55 to
150
°C
J
SC−70/SOT−323
CASE 419
T
STG
2
1
Source Current (Body Diode), Continuous
I
−0.46
260
A
Gate Source
S
STYLE 8
Lead Temperature for Soldering Purposes
T
°C
L
(1/8″ from case for 10 s)
TS
M
G
= Device Code
= Date Code*
= Pb−Free Package
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Max
430
375
Units
(Note: Microdot may be in either location)
Junction−to−Ambient – Steady State (Note 1)
Junction−to−Ambient − t ≤ 5 s (Note 1)
R
°C/W
*Date Code orientation may vary depending
upon manufacturing location.
q
JA
JA
R
q
ORDERING INFORMATION
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
†
Device
Package
Shipping
NTS2101PT1
SOT−323
3000/Tape & Reel
1. Surface−mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces).
SOT−323
(Pb−Free)
NTS2101PT1G
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
March, 2006 − Rev. 1
NTS2101P/D