Datasheet > NTR2101PT1G

NTR2101PT1G

更新时间： 2024-09-23 12:30:59

品牌	Logo	应用领域
TYSEMI		晶体开关晶体管光电二极管高压
页数	文件大小	规格书
2页	107K
描述
Small Signal MOSFET â8.0 V, â3.7 A, Single PâChannel, SOTâ23 High Side Load Switch

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Product specification

NTR2101P

Small Signal MOSFET

Typ

I Max

(BR)DSS

DS(on)

39 mW @ −4.5 V

52 mW @ −2.5 V

−8.0 V, −3.7 A, Single P−Channel, SOT−23

−8.0 V

−3.7 A

Features

79 mW @ −1.8 V

• Leading Trench Technology for Low R

DS(on)

P−Channel

• −1.8 V Rated for Low Voltage Gate Drive

• SOT−23 Surface Mount for Small Footprint (3 x 3 mm)

• This is a Pb−Free Device

Applications

• High Side Load Switch

• DC−DC Conversion

• Cell Phone, Notebook, PDAs, etc.

MARKING DIAGRAM &

PIN ASSIGNMENT

MAXIMUM RATINGS (T = 25°C unless otherwise stated)

Parameter

Drain−to−Source Voltage

Symbol

Value

−8.0

8.0

Unit

Drain

DSS

Gate−to−Source Voltage

TR7 MG

Continuous Drain

Current (Note 1)

t ≤ 5 s T = 25°C

−3.7

−3.0

0.96

SOT−23

T = 70°C

CASE 318

STYLE 21

Gate

Power Dissipation

(Note 1)

t ≤ 5 s

Source

TR7

= Specific Device Code

= Date Code*

= Pb−Free Package

Pulsed Drain Current

t = 10 ms

−11

Operating Junction and Storage Temperature

T ,

−55 to

150

°C

STG

(Note: Microdot may be in either location)

*Date Code orientation may vary depending

upon manufacturing location.

Source Current (Body Diode)

−1.2

Lead Temperature for Soldering Purposes

260

°C

(1/8″ from case for 10 s)

ORDERING INFORMATION

THERMAL RESISTANCE RATINGS

Parameter

Symbol

Max

160

130

Unit

†

Device

Package

Shipping

Junction−to−Ambient – Steady State

Junction−to−Ambient − t ≤ 5 s

°C/W

NTR2101PT1G

SOT−23

3000/Tape & Reel

(Pb−Free)

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. Surface mounted on FR4 board using 1 in sq pad size

(Cu area = 1.127 in sq [1 oz] including traces).

http://www.twtysemi.com

sales@twtysemi.com

1 of 2

4008-318-123

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