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NTP5426NG PDF预览

NTP5426NG

更新时间: 2024-11-26 12:36:43
品牌 Logo 应用领域
安森美 - ONSEMI 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
7页 136K
描述
Power MOSFET 120 Amps, 60 Volts N-Channel D2PAK, TO-220

NTP5426NG 技术参数

是否无铅: 不含铅生命周期:End Of Life
包装说明:FLANGE MOUNT, R-PSFM-T3针数:3
Reach Compliance Code:not_compliantECCN代码:EAR99
Factory Lead Time:1 week风险等级:5.71
雪崩能效等级(Eas):735 mJ外壳连接:ISOLATED
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:60 V
最大漏极电流 (ID):120 A最大漏源导通电阻:0.006 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-220AB
JESD-30 代码:R-PSFM-T3JESD-609代码:e3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):260 A表面贴装:NO
端子面层:Tin (Sn)端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

NTP5426NG 数据手册

 浏览型号NTP5426NG的Datasheet PDF文件第2页浏览型号NTP5426NG的Datasheet PDF文件第3页浏览型号NTP5426NG的Datasheet PDF文件第4页浏览型号NTP5426NG的Datasheet PDF文件第5页浏览型号NTP5426NG的Datasheet PDF文件第6页浏览型号NTP5426NG的Datasheet PDF文件第7页 
NTB5426N, NTP5426N,  
NVB5426N  
Power MOSFET  
120 Amps, 60 Volts  
N-Channel D2PAK, TO-220  
http://onsemi.com  
Features  
Low R  
DS(on)  
I
MAX  
D
High Current Capability  
V
R
MAX  
DS(ON)  
(Note 1)  
(BR)DSS  
Avalanche Energy Specified  
60 V  
6.0 mW @ 10 V  
120 A  
AEC Q101 Qualified NVB5426N  
These Devices are PbFree and are RoHS Compliant  
NChannel  
Applications  
Power Supplies  
Converters  
Power Motor Controls  
Bridge Circuits  
D
G
MAXIMUM RATINGS (T = 25°C Unless otherwise specified)  
J
S
Parameter  
DraintoSource Voltage  
Symbol  
Value  
60  
Unit  
V
V
DSS  
4
GatetoSource Voltage Continuous  
V
$20  
30  
V
GS  
4
GatetoSource Voltage Nonrepetitive  
(T < 10 ms)  
P
V
GS  
V
1
2
Continuous Drain  
Current R  
Steady  
State  
T
= 25°C  
= 100°C  
= 25°C  
I
120  
85  
A
C
D
3
q
JC  
2
T
C
(Note 1)  
TO220AB  
CASE 221A  
STYLE 5  
D PAK  
CASE 418B  
STYLE 2  
1
Power Dissipation  
Steady  
State  
T
C
P
215  
W
D
2
R
(Note 1)  
q
JC  
3
Pulsed Drain Current  
t = 10 ms  
I
260  
A
p
DM  
MARKING DIAGRAMS  
& PIN ASSIGNMENTS  
Operating and Storage Temperature Range  
T , T  
J
55 to  
+175  
°C  
stg  
4
4
Drain  
Drain  
Source Current (Body Diode)  
I
S
60  
A
Single Pulse DraintoSource Avalanche  
E
AS  
735  
mJ  
Energy Starting T = 25°C  
J
(V = 50 V , V = 10 V , I = 70 A,  
dc L(pk)  
DD  
dc  
GS  
5426N  
AYWW  
L = 0.3 mH, R = 25 W)  
G
5426N  
AYWW  
Lead Temperature for Soldering  
Purposes, 1/8from Case for 10 Seconds  
T
L
260  
°C  
2
1
Gate  
3
1
Gate  
3
Drain  
Source  
THERMAL RESISTANCE RATINGS  
Source  
Parameter  
Symbol  
Max  
Unit  
°C/W  
2
Drain  
JunctiontoCase (Drain)  
Steady State (Note 1)  
R
0.7  
q
JC  
G
= PbFree Device  
= Assembly Location  
= Year  
A
Y
WW  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Surface mounted on FR4 board using 1 sq in pad size,  
= Work Week  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 2 of this data sheet.  
(Cu Area 1.127 sq in [1 oz] including traces).  
© Semiconductor Components Industries, LLC, 2011  
1
Publication Order Number:  
October, 2011 Rev. 1  
NTB5426N/D  
 

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