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NTMS4873NFR2G

更新时间: 2024-11-06 05:54:23
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 116K
描述
Power MOSFET 30 V, 11.5 A, N−Channel, SO−8

NTMS4873NFR2G 技术参数

是否无铅: 不含铅生命周期:Obsolete
零件包装代码:SOT包装说明:LEAD FREE, CASE 751-07, SOIC-8
针数:8Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.42
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:30 V
最大漏极电流 (Abs) (ID):11.5 A最大漏极电流 (ID):7.1 A
最大漏源导通电阻:0.012 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
最大反馈电容 (Crss):225 pFJESD-30 代码:R-PDSO-G8
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:8
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):2.31 W
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子面层:Tin (Sn)
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

NTMS4873NFR2G 数据手册

 浏览型号NTMS4873NFR2G的Datasheet PDF文件第2页浏览型号NTMS4873NFR2G的Datasheet PDF文件第3页浏览型号NTMS4873NFR2G的Datasheet PDF文件第4页浏览型号NTMS4873NFR2G的Datasheet PDF文件第5页浏览型号NTMS4873NFR2G的Datasheet PDF文件第6页 
NTMS4873NF  
Power MOSFET  
30 V, 11.5 A, NChannel, SO8  
Features  
Low R  
to Minimize Conduction Losses  
Low Capacitance to Minimize Driver Losses  
Includes SyncFET Schottky Diode  
DS(on)  
http://onsemi.com  
Optimized Gate Charge to Minimize Switching Losses  
SOIC8 Surface Mount Package Saves Board Space  
This is a PbFree Device  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
12 mW @ 10 V  
15 mW @ 4.5 V  
30 V  
11.5 A  
Applications  
Synchronous FET for DCDC Converters  
Low Side Notebook NonVCORE Converters  
NChannel  
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
D
Parameter  
DraintoSource Voltage  
Symbol Value Unit  
V
DSS  
30  
20  
V
V
A
GatetoSource Voltage  
V
GS  
Continuous Drain  
I
G
T = 25°C  
8.9  
7.2  
1.39  
D
A
Current R  
(Note 1)  
q
JA  
T = 70°C  
A
S
Power Dissipation R  
(Note 1)  
T = 25°C  
A
P
W
A
q
D
JA  
JA  
MARKING DIAGRAM/  
PIN ASSIGNMENT  
Continuous Drain  
I
D
T = 25°C  
A
7.1  
5.7  
Current R  
(Note 2)  
q
JA  
T = 70°C  
A
Steady  
State  
1
8
Power Dissipation R  
(Note 2)  
T = 25°C  
A
P
I
0.87  
W
A
q
D
Source  
Source  
Source  
Gate  
Drain  
Drain  
Drain  
Drain  
1
SO8  
Continuous Drain  
T = 25°C  
A
11.5  
9.2  
D
CASE 751  
STYLE 12  
Current R , t v 10 s  
q
JA  
T = 70°C  
A
(Note 1)  
Top View  
Power Dissipation  
T = 25°C  
P
2.31  
W
A
D
4873NF = Device Code  
R
, t v 10 s(Note 1)  
q
JA  
A
= Assembly Location  
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
56  
A
A
p
Y
= Year  
WW  
G
= Work Week  
= PbFree Package  
(Note: Microdot may be in either location)  
Operating Junction and Storage Temperature  
T ,  
stg  
55 to  
°C  
J
T
150  
Source Current (Body Diode)  
I
S
3.3  
A
Single Pulse DraintoSource Avalanche Energy  
E
60.5  
mJ  
AS  
ORDERING INFORMATION  
(T = 25°C, V = 30 V, V = 10 V,  
J
DD  
GS  
I = 11 A , L = 1 mH, R = 25 W)  
L
pk  
G
Device  
Package  
Shipping  
2500/Tape & Reel  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
260  
°C  
L
NTMS4873NFR2G  
SO8  
(PbFree)  
THERMAL RESISTANCE MAXIMUM RATINGS  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
Parameter  
Symbol Value Unit  
°C/W  
JunctiontoAmbient – Steady State (Note 1)  
JunctiontoAmbient – t v 10 s (Note 1)  
JunctiontoFoot (Drain)  
R
R
89.9  
54.2  
35.6  
143  
q
q
JA  
JA  
R
R
q
JF  
JA  
JunctiontoAmbient – Steady State (Note 2)  
q
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Surfacemounted on FR4 board using 1 sqin pad, 2 oz Cu.  
2. Surfacemounted on FR4 board using the minimum recommended pad size.  
© Semiconductor Components Industries, LLC, 2009  
1
Publication Order Number:  
January, 2009 Rev. 1  
NTMS4873NF/D  
 

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