NTF2955
Power MOSFET
−60 V, −2.6 A, Single P−Channel SOT−223
Features
• TMOS7 Design for low R
DS(on)
• Withstands High Energy in Avalanche and Commutation Modes
http://onsemi.com
Applications
V
R
TYP
I MAX
D
(BR)DSS
DS(on)
• Power Supplies
• PWM Motor Control
• Converters
−60 V
145 mW @ −10 V
−2.6 A
P−Channel
• Power Management
D
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Parameter
Drain−to−Source Voltage
Symbol Value
Unit
V
V
DSS
−60
±20
G
Gate−to−Source Voltage
V
GS
V
Continuous Drain
Current (Note 1)
Steady T = 25°C
I
D
−2.6
−2.0
A
S
A
State
T = 85°C
A
MARKING
DIAGRAM
4
SOT−223
CASE 318E
STYLE 3
Power Dissipation
(Note 1)
Steady T = 25°C
State
P
D
2.3
W
A
1
2
3
2955
LWW
Continuous Drain
Current (Note 2)
Steady T = 25°C
I
−1.7
−1.3
1.0
A
A
D
2955
L
WW
= Device Code
= Location Code
= Work Week
State
T = 85°C
A
Power Dissipation
(Note 2)
T = 25°C
A
P
W
D
PIN ASSIGNMENT
Pulsed Drain Current
tp = 10 ms
I
−10.4
A
DM
4
Drain
Operating Junction and Storage Temperature
T ,
−55 to
175
°C
J
T
STG
Single Pulse Drain−to−Source Avalanche
EAS
225
mJ
Energy (V = 25 V, V = 10 V, I = 6.7 A,
DD
G
PK
L = 10 mH, R = 25 W)
G
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
T
L
260
°C
1
2
3
Gate Drain Source
THERMAL RESISTANCE RATINGS
Parameter
ORDERING INFORMATION
Symbol
Max
14
Unit
†
Device
Package
Shipping
Junction−to−Tab (Drain) − Steady State (Note 2)
Junction−to−Ambient − Steady State (Note 1)
Junction−to−Ambient − Steady State (Note 2)
R
°C/W
q
JC
q
JA
q
JA
NTF2955T1
NTF2955T3
SOT−223
SOT−223
1000/Tape & Reel
4000/Tape & Reel
R
R
65
150
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
1. When surface mounted to an FR4 board using 1 in. pad size
2
(Cu. area = 1.127 in [1 oz] including traces)
2. When surface mounted to an FR4 board using the minimum recommended
2
pad size (Cu. area = 0.341 in )
Semiconductor Components Industries, LLC, 2004
1
Publication Order Number:
August, 2004 − Rev. 1
NTF2955/D