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NTF2955

更新时间: 2024-11-25 22:28:47
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安森美 - ONSEMI /
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6页 60K
描述
Power MOSFET

NTF2955 数据手册

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NTF2955  
Power MOSFET  
−60 V, 2.6 A, Single P−Channel SOT−223  
Features  
TMOS7 Design for low R  
DS(on)  
Withstands High Energy in Avalanche and Commutation Modes  
http://onsemi.com  
Applications  
V
R
TYP  
I MAX  
D
(BR)DSS  
DS(on)  
Power Supplies  
PWM Motor Control  
Converters  
−60 V  
145 mW @ −10 V  
−2.6 A  
P−Channel  
Power Management  
D
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
Drain−to−Source Voltage  
Symbol Value  
Unit  
V
V
DSS  
−60  
±20  
G
Gate−to−Source Voltage  
V
GS  
V
Continuous Drain  
Current (Note 1)  
Steady T = 25°C  
I
D
−2.6  
−2.0  
A
S
A
State  
T = 85°C  
A
MARKING  
DIAGRAM  
4
SOT−223  
CASE 318E  
STYLE 3  
Power Dissipation  
(Note 1)  
Steady T = 25°C  
State  
P
D
2.3  
W
A
1
2
3
2955  
LWW  
Continuous Drain  
Current (Note 2)  
Steady T = 25°C  
I
−1.7  
−1.3  
1.0  
A
A
D
2955  
L
WW  
= Device Code  
= Location Code  
= Work Week  
State  
T = 85°C  
A
Power Dissipation  
(Note 2)  
T = 25°C  
A
P
W
D
PIN ASSIGNMENT  
Pulsed Drain Current  
tp = 10 ms  
I
−10.4  
A
DM  
4
Drain  
Operating Junction and Storage Temperature  
T ,  
−55 to  
175  
°C  
J
T
STG  
Single Pulse Drain−to−Source Avalanche  
EAS  
225  
mJ  
Energy (V = 25 V, V = 10 V, I = 6.7 A,  
DD  
G
PK  
L = 10 mH, R = 25 W)  
G
Lead Temperature for Soldering Purposes  
(1/8” from case for 10 s)  
T
L
260  
°C  
1
2
3
Gate Drain Source  
THERMAL RESISTANCE RATINGS  
Parameter  
ORDERING INFORMATION  
Symbol  
Max  
14  
Unit  
Device  
Package  
Shipping  
Junction−to−Tab (Drain) − Steady State (Note 2)  
Junction−to−Ambient − Steady State (Note 1)  
Junction−to−Ambient − Steady State (Note 2)  
R
°C/W  
q
JC  
q
JA  
q
JA  
NTF2955T1  
NTF2955T3  
SOT−223  
SOT−223  
1000/Tape & Reel  
4000/Tape & Reel  
R
R
65  
150  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
1. When surface mounted to an FR4 board using 1 in. pad size  
2
(Cu. area = 1.127 in [1 oz] including traces)  
2. When surface mounted to an FR4 board using the minimum recommended  
2
pad size (Cu. area = 0.341 in )  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
August, 2004 − Rev. 1  
NTF2955/D  
 

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