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NTE5611 PDF预览

NTE5611

更新时间: 2024-11-26 04:35:59
品牌 Logo 应用领域
NTE 三端双向交流开关
页数 文件大小 规格书
2页 24K
描述
TRIAC - 10 Amp

NTE5611 技术参数

生命周期:Active包装说明:FLANGE MOUNT, R-PSFM-T3
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8541.30.00.80风险等级:2.16
外壳连接:MAIN TERMINAL 2配置:SINGLE
最大直流栅极触发电流:75 mA最大直流栅极触发电压:2.5 V
最大维持电流:50 mAJEDEC-95代码:TO-127
JESD-30 代码:R-PSFM-T3元件数量:1
端子数量:3封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
认证状态:Not Qualified最大均方根通态电流:10 A
断态重复峰值电压:25 V子类别:TRIACs
表面贴装:NO端子形式:THROUGH-HOLE
端子位置:SINGLE触发设备类型:4 QUADRANT LOGIC LEVEL TRIAC
Base Number Matches:1

NTE5611 数据手册

 浏览型号NTE5611的Datasheet PDF文件第2页 
NTE5611 thru NTE5618  
TRIAC – 10 Amp  
Description:  
The NTE5611 through NTE5618 TRIACs are designed primarily for full–wave AC control applica-  
tions, such as light dimmers, motor controls, heating controls, and power supplies; or wherever full–  
wave silicon gate controlled solid–state devices are needed. TRIAC type thyristors switch from a  
blocking to a conducting state for either polarity of applied anode voltage with positive or negative gate  
triggering.  
Features:  
D All Diffused and Passivated Junctions for Greater Parameter Uniformity and Stability  
D Small, Rugged, Thermopad Construction for Low Thermal Resistance, High Heat Dissipation  
and Durability.  
D Gate Triggering Guaranteed in Four Modes  
Absolute Maximum Ratings: (Note 1)  
Repetitive Peak Off–State Voltage (TJ = +100°C, Note 2), VDRM  
NTE5611 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25V  
NTE5612 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50V  
NTE5613 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100V  
NTE5615 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300V  
NTE5618 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 600V  
On–State Current RMS (TC = +75°C), IT(RMS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10A  
Peak Surge Current (One Full Cycle, 60Hz, TJ = –40° to +100°C), ITSM . . . . . . . . . . . . . . . . . . 100A  
Circuit Fusing Considerations (TJ = –40° to +100°C, t = 1.0 to 8.3ms), I2t . . . . . . . . . . . . . . . . 40A2s  
Peak Gate Power, PGM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10W  
Average Gate Power, PG(AV) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5W  
Peak Gate Current, IGM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2A  
Operating Junction Temperature Range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40° to +100°C  
Storage Temperature Range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40° to +150°C  
Mounting Torque (6–32 Screw, Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12in. lb.  
Thermal Resistance, Junction–to–Case, RthJC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2°C/W  
Thermal Resistance, Case–to–Ambient, RthJA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50°C/W  
Note 1. NTE5618 is a discontinued device and no longer available.  
Note 2. Ratings apply for open gate conditions. Thyristor devices shall not be tested with a constant  
current source for blocking capability such that the voltage applied exceeds the rated block-  
ing voltage.  
Note 3. Torque rating applies with use of torque washer. Mounting torque in excess of 8 in. lbs. does  
not appreciably lower case–to–sink thermal resistance. Anode lead and heatsink contact  
pad are common.  
Note 4. For soldering purposes (either terminal connection or device mounting), soldering tempera-  
tures shall not exceed +230°C.  

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